SLVSE24C November   2017  – August 2019 TPS25820 , TPS25821

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 USB Type C Basic
      2. 7.1.2 Configuration Channel
      3. 7.1.3 Detecting a Connection
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Configuration Channel Pins CC1 and CC2
      2. 7.3.2 Current Capability Advertisement and VBUS Overload Protection
      3. 7.3.3 FAULT Response
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 REF
      6. 7.3.6 Plug Polarity Detection
      7. 7.3.7 Sink Attachment Indicator
      8. 7.3.8 Device Enable Control
      9. 7.3.9 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Type-C Source Port Implementation without BC 1.2 Support
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input and Output Capacitance Considerations
          2. 8.2.1.1.2 System Level ESD Protection
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Type -C Source Port Implementation with BC 1.2 (DCP Mode) Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Implementing a USB 3.1 Type-C Charging Port with the TPS25820
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Implementing TPS25821 in USB Car Chargers
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

–40°C ≤ TJ ≤ 125°C, 4.5 V ≤ VIN ≤ 5.5 V, VEN = VCHG = VIN, RREF = 100 kΩ. Typical values are at 25°C. All voltages are with respect to GND. IOUT and IOS defined positive out of the indicated pin (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OUT - POWER SWITCH
RDS(on) On resistance(1) TJ = 25°C, IOUT = 1.5 A 64 70
–40°C ≤ TJ ≤ 85°C, IOUT = 1.5 A 64 85
–40°C ≤ TJ ≤ 125°C, IOUT = 1.5 A 64 98
IREV OUT to IN reverse leakage current VOUT = 5.5 V, 0 ≤ VIN ≤ 5.5 V, VEN = 0 V,
–40°C ≤ TJ ≤ 85°C, measure IIN
0 3 µA
OUT - CURRENT LIMIT
IOS Short circuit current limit (1) 1.6 1.72 1.84 A
RREF = 10 Ω 4.0
OUT - DISCHARGE
Discharge resistance VOUT = 4 V 400 500 600 Ω
Bleed discharge resistance VOUT = 4 V, No Sink termination on CC lines, time > tw_OUT_DCHG 90 150 250
VTH Rising threshold for not discharged 800 mV
REF
IOS Short circuit current RREF = 10 Ω 9.5 17.5 µA
VO Output voltage 0.78 0.8 0.82 V
FAULT
VOL Output low voltage IFAULT = 1 mA 250 mV
IOFF Off-state leakage VFAULT = 5.5 V 1 µA
CC1/CC2 - VCONN POWER SWITCH (TPS25820)
RDS(on) On resistance TJ = 25°C, ICCx = 250 mA 480 530
-40°C ≤ TJ ≤ 85°C, ICCx = 250 mA 480 645
-40°C ≤ TJ ≤ 125°C, ICCx = 250 mA 480 755
CC1/CC2 - VCONN POWER SWITCH - CURRENT LIMIT (TPS25820)
IOS Short circuit current limit(1) 315 370 425 mA
RREF = 10 Ω 1000
CC1/CC2 – CONNECT MANAGEMENT
ISRC Sourcing current VCHG = 0 V, 0 V ≤ VCCx ≤ 1.5 V, after VSINK = 0 V 73 80 85 µA
0 V ≤ VCCx ≤ 1.5 V, after VSINK = 0 V 168 180 190
VCHG = 0 V or VIN, 0 V ≤ VCCx ≤ 1.5 V, before VSINK = 0 V 64 80 96
IREV Reverse leakage current CCx is the CC pin under test, CCy is the other CC pin. VCCx = 5.5 V, CCy floating, VEN = 0 V or 0 V ≤  VIN ≤ 5.5 V, –40°C ≤ TJ ≤ 85°C,  IREV is current into CCx pin. 0 5 µA
CCx is the CC pin under test, CCy is the other CC pin. VCCx = 5.5 V, CCy = 0 V, –40°C ≤ TJ ≤ 85°C,  IREV is current into CCx pin. 5 10
CC1/CC2 – CONNECT MANAGEMENT – VCONN DISCHARGE MODE
Discharge resistance (TPS25820) CC pin that was providing VCONN before detach: VCCX = 4 V 400 500 600 Ω
VTH Falling threshold for discharged (TPS25820) CC pin that was providing VCONN before detach 570 600 630 mV
Discharged threshold hysteresis  (TPS25820) 100 mV
SINK, POL
VOL Output low voltage ISNK_PIN = 1 mA 250 mV
IOFF Off-state leakage VPIN = 5.5 V 1 µA
EN, CHG - LOGIC INPUTS
VTH Rising threshold voltage for output logic change 1.45 1.8 V
VTH Falling threshold voltage for output logic change 1.00 1.35 V
Hysteresis(2) 100 mV
IIN Input current VPIN = 0 V or 5.5 V –0.5 0.5 µA
OVER TEMPERATURE SHUT DOWN
TTH_OTSD2 Rising threshold temperature for device shutdown 155 °C
Hysteresis(2) 20 °C
TTH_OTSD1 Rising threshold temperature for OUT/ VCONN switch shutdown in current limit 135 °C
Hysteresis(2) 20 °C
IN
VTH Rising threshold voltage for not UVLO 3.9 4.1 4.3 V
Hysteresis(2) 100 mV
II Disabled supply current VEN = 0 V, –40°C ≤ TJ ≤ 85°C 1 µA
Enabled supply current with CC lines open –40°C ≤ TJ ≤ 85°C 1 4
Enabled supply current with dangling Ra cable attached 150 195
Enabled supply current with Sink attached via cable that is electronically marked (includes IN current that provides the CC output current to the sink Rd resistor) VCHG = 0 V 232 275
332 380
Enabled supply current with Sink attached via cable that is not electronically marked (includes IN current that provides the CC output current to the sink Rd resistor) VCHG = 0 V 210 250
310 355
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
These parameters are provided for reference only and do not constitute part of TI’s published specifications for purposes of TI’s product warranty.