SLVSE24C November   2017  – August 2019 TPS25820 , TPS25821

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 USB Type C Basic
      2. 7.1.2 Configuration Channel
      3. 7.1.3 Detecting a Connection
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Configuration Channel Pins CC1 and CC2
      2. 7.3.2 Current Capability Advertisement and VBUS Overload Protection
      3. 7.3.3 FAULT Response
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 REF
      6. 7.3.6 Plug Polarity Detection
      7. 7.3.7 Sink Attachment Indicator
      8. 7.3.8 Device Enable Control
      9. 7.3.9 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Type-C Source Port Implementation without BC 1.2 Support
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input and Output Capacitance Considerations
          2. 8.2.1.1.2 System Level ESD Protection
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Type -C Source Port Implementation with BC 1.2 (DCP Mode) Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Implementing a USB 3.1 Type-C Charging Port with the TPS25820
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Implementing TPS25821 in USB Car Chargers
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4 Thermal Shutdown

The device has two internal overtemperature shutdown thresholds, TTH_OTSD1 and TTH_OTSD2, to protect the internal FET from damage and overall safety of the system. When the device temperature exceeds TTH_OTSD1, any switch in current limit (OUT switch or VCONN switch) is disabled. The device does auto-retry recovery by re-enabling the switch when die temperature decreases by 20°C. When TTH_OTSD2 is exceeded all open drain outputs are left open and the device is disabled such that minimum power/heat is dissipated. The device does auto-retry recovery by attempting to power-up when die temperature decreases by 20°C.