SLVSE57C June   2017  – April 2018 TPS2595

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      TPS25953x Overvoltage Clamp Response Time
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Protection (UVP) and Undervoltage Lockout (UVLO)
      2. 8.3.2 Overvoltage Protection
        1. 8.3.2.1 Overvoltage Lockout (OVLO)
        2. 8.3.2.2 Overvoltage Clamp (OVC)
      3. 8.3.3 Inrush Current, Overcurrent and Short Circuit Protection
        1. 8.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 8.3.3.2 Active Current Limiting
        3. 8.3.3.3 Short Circuit Protection
      4. 8.3.4 Overtemperature Protection (OTP)
      5. 8.3.5 Fault Indication (FLT )
      6. 8.3.6 Quick Output Discharge (QOD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Fault Pin Functional Mode 1: Single Device, Self-Controlled
      2. 8.4.2 Enable and Fault Pin Functional Mode 2: Single Device, Host-Controlled
      3. 8.4.3 Enable and Fault Pin Functional Mode 2: Multiple Devices, Self-Controlled
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Current-Limit Threshold: RILM Selection
        2. 9.2.2.2 Undervoltage Lockout Set Point
        3. 9.2.2.3 Setting Output Voltage Ramp Time (TdVdT)
          1. 9.2.2.3.1 Case 1: Start-Up Without Load. Only Output Capacitance COUT Draws Current
          2. 9.2.2.3.2 Case 2: Start-Up With Load. Output Capacitance COUT and Load Draw Current
      3. 9.2.3 Support Component Selection: CIN
      4. 9.2.4 Application Curves
      5. 9.2.5 Controlled Power Down (Quick Output Discharge) using TPS2595x5
      6. 9.2.6 Overvoltage Lockout using TPS259573
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
      2. 12.1.2 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Maximum input voltage IN –0.3 20 V
VOUT Maximum output voltage OUT –0.3 VIN + 0.3 V
VOUT,PLS Minimum output voltage pulse (< 1 µs) OUT –1.2 V
VEN Maximum enable pin voltage EN/UVLO or EN/OVLO –0.3 7 V
VFLTB Maximum fault pin voltage (TPS2595x0/1/3) FLT –0.3 7 V
VQOD Maximum QOD pin voltage (TPS2595x5) QOD –0.3 7 V
VdVdt Maximum dVdt pin voltage dVdt 2.5 V
IFLTB Maximum fault pin sink current FLT 10 mA
IMAX Maximum continuous switch current IN to OUT Internally limited
TJ,MAX Maximum junction temperature Internally limited
TLEAD Maximum lead temperature  300 °C
TSTG Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.