SLVSH35A October   2023  – February 2024 TPS274C65CP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Diagrams
      2. 8.3.2 Programmable Current Limit
      3. 8.3.3 Protection Mechanisms
        1. 8.3.3.1 Over-current Protection
        2. 8.3.3.2 Short-Circuit Protection
          1. 8.3.3.2.1 VS During Short-to-Ground
        3. 8.3.3.3 Thermal Shutdown Behavior
        4. 8.3.3.4 Inductive-Load Switching-Off Clamp
        5. 8.3.3.5 Inductive Load Demagnetization
        6. 8.3.3.6 Thermal Shutdown
        7. 8.3.3.7 Undervoltage Protection on VS (UVP)
        8. 8.3.3.8 Undervoltage Lockout on Low Voltage Supply (VDD_UVLO)
        9. 8.3.3.9 Power-Up and Power-Down Behavior
      4. 8.3.4 Diagnostic Mechanisms
        1. 8.3.4.1 Fault Indication
        2. 8.3.4.2 Short-to-Battery and Open-Load Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Off
      2. 8.4.2 Active
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 IEC 61000-4-5 Surge
        2. 9.2.2.2 Loss of GND
        3. 9.2.2.3 Paralleling Channels
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.