SLVSHR0 May   2025 TPS2HCS08-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 A Version Package
    2. 5.2 Pinout - Version A
    3. 5.3 Version B Package
    4. 5.4 Pinout - Version B
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 State Diagram
      2. 8.3.2 Output Control
      3. 8.3.3 SPI Mode Operation
      4. 8.3.4 Fault Reporting
      5. 8.3.5 SLEEP
      6. 8.3.6 CONFIG/ACTIVE
      7. 8.3.7 LIMP_HOME State (Version A only)
      8. 8.3.8 Battery Supply Input (VBB) Under-voltage
      9. 8.3.9 LOW POWER MODE (LPM) States
        1. 8.3.9.1 MANUAL_LPM State
        2. 8.3.9.2 AUTO_LPM State
    4. 8.4 Feature Description
      1. 8.4.1 Protection Mechanisms
        1. 8.4.1.1 Overcurrent Protection
          1. 8.4.1.1.1 Inrush Period - Overcurrent Protection
          2. 8.4.1.1.2 Overcurrent Protection - Steady State Operation
          3. 8.4.1.1.3 Programmable Fuse Protection
          4. 8.4.1.1.4 Immediate Shutdown Overcurrent Protection (IOCP)
          5. 8.4.1.1.5 Auto Retry and Latch-off Behavior
        2. 8.4.1.2 Thermal Shutdown
        3. 8.4.1.3 Reverse Battery
      2. 8.4.2 Diagnostic Mechanisms
        1. 8.4.2.1 Integrated ADC
        2. 8.4.2.2 Digital Current Sense Output
        3. 8.4.2.3 Output Voltage Measurement
        4. 8.4.2.4 MOSFET Temperature Measurement
        5. 8.4.2.5 Drain-to-Source Voltage (VDS) Measurement
        6. 8.4.2.6 VBB Voltage Measurement
        7. 8.4.2.7 VOUT Short-to-Battery and Open-Load
          1. 8.4.2.7.1 Measurement With Channel Output (FET) Enabled
          2. 8.4.2.7.2 Detection With Channel Output Disabled
    5. 8.5 Parallel Mode Operation
    6. 8.6 TPS2HCS08 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Thermal Considerations
        2. 9.2.2.2 Configuring the Capacitive Charging Mode
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TPS2HCS08-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI) and is intended for power distribution and actuator drive applications. The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection configurable via SPI with sufficient flexibility to support loads that require large inrush currents and provide improved protection. The device also integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition. The two features together allow optimization of the wire harness for any load profile with full protection.

The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes two low power mode (LPM) states, an auto entry mode or a manual entry mode, that enables the device to provide current to the load ECU while only consuming about 10–20μA of current.

The TPS2HCS08-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.

The TPS2HCS08-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
TPS2HCS08-Q1PWP (HTSSOP, 16)5mm x 6.4mm
(1) For all available packages, see Section 12.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
TPS2HCS08-Q1 Simplified Schematic Simplified Schematic