SLVSHR0 May   2025 TPS2HCS08-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 A Version Package
    2. 5.2 Pinout - Version A
    3. 5.3 Version B Package
    4. 5.4 Pinout - Version B
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 State Diagram
      2. 8.3.2 Output Control
      3. 8.3.3 SPI Mode Operation
      4. 8.3.4 Fault Reporting
      5. 8.3.5 SLEEP
      6. 8.3.6 CONFIG/ACTIVE
      7. 8.3.7 LIMP_HOME State (Version A only)
      8. 8.3.8 Battery Supply Input (VBB) Under-voltage
      9. 8.3.9 LOW POWER MODE (LPM) States
        1. 8.3.9.1 MANUAL_LPM State
        2. 8.3.9.2 AUTO_LPM State
    4. 8.4 Feature Description
      1. 8.4.1 Protection Mechanisms
        1. 8.4.1.1 Overcurrent Protection
          1. 8.4.1.1.1 Inrush Period - Overcurrent Protection
          2. 8.4.1.1.2 Overcurrent Protection - Steady State Operation
          3. 8.4.1.1.3 Programmable Fuse Protection
          4. 8.4.1.1.4 Immediate Shutdown Overcurrent Protection (IOCP)
          5. 8.4.1.1.5 Auto Retry and Latch-off Behavior
        2. 8.4.1.2 Thermal Shutdown
        3. 8.4.1.3 Reverse Battery
      2. 8.4.2 Diagnostic Mechanisms
        1. 8.4.2.1 Integrated ADC
        2. 8.4.2.2 Digital Current Sense Output
        3. 8.4.2.3 Output Voltage Measurement
        4. 8.4.2.4 MOSFET Temperature Measurement
        5. 8.4.2.5 Drain-to-Source Voltage (VDS) Measurement
        6. 8.4.2.6 VBB Voltage Measurement
        7. 8.4.2.7 VOUT Short-to-Battery and Open-Load
          1. 8.4.2.7.1 Measurement With Channel Output (FET) Enabled
          2. 8.4.2.7.2 Detection With Channel Output Disabled
    5. 8.5 Parallel Mode Operation
    6. 8.6 TPS2HCS08 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Thermal Considerations
        2. 9.2.2.2 Configuring the Capacitive Charging Mode
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

TPS2HCS08-Q1 Transient Thermal Impedance
JEDEC 2s2p PCB
Board dimensions (W x L x H): 76.2mm x 114.3mm x 1.6mm
Figure 6-1 Transient Thermal Impedance
TPS2HCS08-Q1 On resistance, OL_ON mode (RON_OL) vs Temperature
IOUT = 500mA Active state
OL_ON_EN_CHx = 1
Figure 6-3 On resistance, OL_ON mode (RON_OL) vs Temperature
TPS2HCS08-Q1 On resistance in MANUAL_LPM (RON,LPM_MAN) vs Temperature
Figure 6-5 On resistance in MANUAL_LPM (RON,LPM_MAN) vs Temperature
TPS2HCS08-Q1 VBB IQ current (IQ,VBB) vs Temperature
ACTIVE state Diagnostics enabled (ISNS, ADC)
IOUT = 0A SCLK off
Figure 6-7 VBB IQ current (IQ,VBB) vs Temperature
TPS2HCS08-Q1 VDD IQ current in MANUAL_LPM (IQ,VDD,LPM_MAN) - channels off vs. Temperature
MANUAL_LPM state VDD = 5V
Channels off IOUT = 0A
Figure 6-9 VDD IQ current in MANUAL_LPM (IQ,VDD,LPM_MAN) - channels off vs. Temperature
TPS2HCS08-Q1 VDD IQ current in MANUAL_LPM (IQ,VDD,LPM_MAN) - one channel enabled vs. Temperature
MANUAL_LPM state VDD = 5V
One channel enabled IOUT = 0A
Figure 6-11 VDD IQ current in MANUAL_LPM (IQ,VDD,LPM_MAN) - one channel enabled vs. Temperature
TPS2HCS08-Q1 VDD IQ current in MANUAL_LPM (IQ,VDD,LPM_MAN) - both channels enabled vs. Temperature
MANUAL_LPM state VDD = 5V
Both channels enabled IOUT = 0A
Figure 6-13 VDD IQ current in MANUAL_LPM (IQ,VDD,LPM_MAN) - both channels enabled vs. Temperature
TPS2HCS08-Q1 KSNS2 % error vs. Temperature
KSNS2 reference = 1400
OL_ON_EN_CHx = 1 IOUT = 25mA
Figure 6-15 KSNS2 % error vs. Temperature
TPS2HCS08-Q1 On resistance (RON) vs Temperature
IOUT = 500mA Active state
OL_ON_EN_CHx = 0
Figure 6-2 On resistance (RON) vs Temperature
TPS2HCS08-Q1 On resistance in AUTO_LPM (RON,LPM_AUTO) vs Temperature
IOUT = 500mA AUTO_LPM state
Figure 6-4 On resistance in AUTO_LPM (RON,LPM_AUTO) vs Temperature
TPS2HCS08-Q1 VBB sleep current (ISLEEP,VBB) vs Temperature
VDD = 5.5V SLEEP state
Figure 6-6 VBB sleep current (ISLEEP,VBB) vs Temperature
TPS2HCS08-Q1 VBB IQ current in MANUAL_LPM (IQ,VBB,LPM_MAN) - channels off vs. Temperature
MANUAL_LPM state VDD = 5V
Channels off
Figure 6-8 VBB IQ current in MANUAL_LPM (IQ,VBB,LPM_MAN) - channels off vs. Temperature
TPS2HCS08-Q1 VBB IQ current in MANUAL_LPM (IQ,VBB,LPM_MAN) - one channel enabled vs. Temperature
MANUAL_LPM state VDD = 5V
One channel enabled IOUT = 0A
Figure 6-10 VBB IQ current in MANUAL_LPM (IQ,VBB,LPM_MAN) - one channel enabled vs. Temperature
TPS2HCS08-Q1 VBB IQ current in MANUAL_LPM (IQ,VBB,LPM_MAN) - both channels enabled vs. Temperature
MANUAL_LPM state VDD = 5V
Both channels enabled IOUT = 0A
Figure 6-12 VBB IQ current in MANUAL_LPM (IQ,VBB,LPM_MAN) - both channels enabled vs. Temperature
TPS2HCS08-Q1 KSNS1 % error vs. Temperature
KSNS1 reference = 5000
OL_ON_EN_CHx = 0 IOUT = 2A
Figure 6-14 KSNS1 % error vs. Temperature