SLVSH18B December   2024  – July 2025 TPS4HC120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics, SNS
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Low Power Mode
        1. 7.3.2.1 Entry into LPM
        2. 7.3.2.2 During LPM
        3. 7.3.2.3 Exiting LPM
      3. 7.3.3 Accurate Current Sense
      4. 7.3.4 Adjustable Current Limit
      5. 7.3.5 Inductive-Load Switching-Off Clamp
      6. 7.3.6 Fault Detection and Reporting
        1. 7.3.6.1 Diagnostic Enable Function
        2. 7.3.6.2 Multiplexing of Current Sense
        3. 7.3.6.3 FAULT Reporting
        4. 7.3.6.4 Fault Table
      7. 7.3.7 Full Diagnostics
        1. 7.3.7.1 Short-to-GND and Overload Detection
        2. 7.3.7.2 Open-Load Detection
          1. 7.3.7.2.1 Channel On
          2. 7.3.7.2.2 Channel Off
        3. 7.3.7.3 Short-to-Battery Detection
        4. 7.3.7.4 Reverse-Polarity and Battery Protection
        5. 7.3.7.5 Thermal Fault Detection
          1. 7.3.7.5.1 Thermal Protection Behavior
      8. 7.3.8 Full Protections
        1. 7.3.8.1 UVLO Protection
        2. 7.3.8.2 Loss of GND Protection
        3. 7.3.8.3 Loss of Power Supply Protection
        4. 7.3.8.4 Reverse Polarity Protection
        5. 7.3.8.5 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 SLEEP
        2. 7.4.1.2 DIAGNOSTIC
        3. 7.4.1.3 ACTIVE
        4. 7.4.1.4 STANDBY DELAY
        5. 7.4.1.5 LOW POWER MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 EMC Transient Disturbances Test
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Without a GND Network
        2. 8.4.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGQ|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DGQ Package, 28-Pin HVVSOP (Top View)
Table 5-1 Pin Functions See Applications Section for full list of recommended components
PIN TYPE DESCRIPTION
NO. NAME
1, 14, 19, 24 NC N/A No internal connection.
2 EN1 Input Input control for channel 1 activation, internal pulldown.
3 EN2 Input Input control for channel 2 activation, internal pulldown.
4 EN3 Input Input control for channel 3 activation, internal pulldown.
5 EN4 Input Input control for channel 4 activation, internal pulldown.
6 SEL1 Input SNS channel-selection high bit; internal pulldown.
7 SEL0 Input SNS channel-selection low bit; internal pulldown.
8 DIAG_EN Input Enable-disable pin for diagnostics, internal pulldown.
9 FLT Output Open drain global fault output. Referred to FAULT, FLT, or fault pin. Recommended 5kΩ–10kΩ pullup resistor.
10 LPM Output Open drain LPM status pin. Pulled high by external supply if the device is in LPM or SLEEP state. Pulled low internally when device is in ACTIVE mode. Recommended 5kΩ–10kΩ pullup resistor.
11 SNS Output SNS current output.
12 ILIM Output Adjustable current limit. Connect a resistor to chip GND, SHORT the pin to chip GND, or leave the pin OPEN to set the current limit value. 
13 GND Power Ground of device. Connect to resistor- diode ground network to have reverse battery protection.
15, 16 VOUT4 Power Output of channel 4 of the high side switch, connected to load.
17, 18 VOUT3 Power Output of channel 3 of the high side switch, connected to load.
20, 21, 22, 23 VBB Power Power supply
25, 26 VOUT2 Power Output of channel 2 of the high side switch, connected to load.
27, 28 VOUT1 Power Output of channel 1 of the high side switch, connected to load.
Thermal Pad Pad Power Thermal Pad, internally shorted to ground.