SLVSD45 December   2015 TPS50601-SP


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2  PVIN vs Frequency
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Adjusting the Output Voltage
      5. 8.3.5  Maximum Duty Cycle Limit
      6. 8.3.6  PVIN vs Frequency
      7. 8.3.7  Safe Start-Up into Prebiased Outputs
      8. 8.3.8  Error Amplifier
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Enable and Adjust UVLO
      11. 8.3.11 Adjustable Switching Frequency and Synchronization (SYNC)
      12. 8.3.12 Slow Start (SS/TR)
      13. 8.3.13 Power Good (PWRGD)
      14. 8.3.14 Bootstrap Voltage (BOOT) and Low Dropout Operation
      15. 8.3.15 Sequencing (SS/TR)
      16. 8.3.16 Output Overvoltage Protection (OVP)
      17. 8.3.17 Overcurrent Protection
        1. High-Side MOSFET Overcurrent Protection
        2. Low-Side MOSFET Overcurrent Protection
      18. 8.3.18 TPS50601-SP Thermal Shutdown
      19. 8.3.19 Turn-On Behavior
      20. 8.3.20 Small Signal Model for Loop Response
      21. 8.3.21 Simple Small Signal Model for Peak Current Mode Control
      22. 8.3.22 Small Signal Model for Frequency Compensation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fixed-Frequency PWM Control
      2. 8.4.2 Continuous Current Mode (CCM) Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. Operating Frequency
        2. Output Inductor Selection
        3. Output Capacitor Selection
        4. Input Capacitor Selection
        5. Slow Start Capacitor Selection
        6. Bootstrap Capacitor Selection
        7. Undervoltage Lockout (UVLO) Set Point
        8. Output Voltage Feedback Resistor Selection
          1. Minimum Output Voltage
        9. Compensation Component Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Device Nomenclature

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

  • Layout is a critical portion of good power supply design. See Layout Example for a PCB layout example.
  • The top layer contains the main power traces for VIN, VOUT, and VPHASE. Also on the top layer are connections for the remaining pins of the TPS50601-SP and a large top side area filled with ground.
  • The top layer ground area should be connected to the internal ground layer(s) using vias at the input bypass capacitor, the output filter capacitor and directly under the TPS50601-SP device to provide a thermal path from the exposed thermal pad land to ground
  • The GND pin should be tied directly to the power pad under the IC and the power pad.
  • For operation at full rated load, the top side ground area together with the internal ground plane, must provide adequate heat dissipating area.
  • There are several signals paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance.
  • To help eliminate these problems, the PVIN pin should be bypassed to ground with a low ESR ceramic bypass capacitor with X5R or X7R dielectric.
  • Care should be taken to minimize the loop area formed by the bypass capacitor connections, the PVIN pins, and the ground connections.
  • The VIN pin must also be bypassed to ground using a low ESR ceramic capacitor with X5R or X7R dielectric.
  • Make sure to connect this capacitor to the quite analog ground trace rather than the power ground trace of the PVIn bypass capacitor.
  • Since the PH connection is the switching node, the output inductor should be located close to the PH pins, and the area of the PCB conductor minimized to prevent excessive capacitive coupling.
  • The output filter capacitor ground should use the same power ground trace as the PVIN input bypass capacitor.
  • Try to minimize this conductor length while maintaining adequate width.
  • The small signal components should be grounded to the analog ground path as shown.
  • The RT pin is sensitive to noise so the RT resistor should be located as close as possible to the IC and routed with minimal lengths of trace.
  • It may be possible to obtain acceptable performance with alternate PCB layouts, however this layout has been shown to produce good results and is meant as a guideline.
  • Land pattern and stencil information is provided in the data sheet addendum.

11.2 Layout Example

TPS50601-SP layout_ex_LVSA94.gif Figure 31. PCB Layout Example