SLUS825C February   2008  – August 2014 TPS53124

PRODUCTION DATA.  

  1. 1Simplified Schematics
  2. 2Pin Configuration and Functions
  3. 3Specifications
    1. 3.1 Absolute Maximum Ratings
    2. 3.2 Handling Ratings
    3. 3.3 Recommended Operating Conditions
    4. 3.4 Thermal Information
    5. 3.5 Electrical Characteristics
    6. 3.6 Typical Characteristics
  4. 4Detailed Description
    1. 4.1 Overview
    2. 4.2 Functional Block Diagram
    3. 4.3 Feature Description
      1. 4.3.1  PWM Operation
      2. 4.3.2  Low-Side Driver
      3. 4.3.3  High-Side Driver
      4. 4.3.4  PWM Frequency and Adaptive On-Time Control
      5. 4.3.5  Soft Start
      6. 4.3.6  Output Discharge Control
      7. 4.3.7  Current Protection
      8. 4.3.8  Over/Under Voltage Protection
      9. 4.3.9  UVLO Protection
      10. 4.3.10 Thermal Shutdown
    4. 4.4 Device Functional Modes
  5. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Typical Application
      1. 5.2.1 Design Requirements
      2. 5.2.2 Detailed Design Procedure
        1. 5.2.2.1 Choose Inductor
        2. 5.2.2.2 Loop Compensation and External Parts Selection
        3. 5.2.2.3 Choose Input Capacitor
        4. 5.2.2.4 Choose Bootstrap Capacitor
        5. 5.2.2.5 Choose VREG5 and V5FILT Capacitor
        6. 5.2.2.6 Choose Output Voltage Set Point Resistors
        7. 5.2.2.7 Choose Over Current Set Point Resistor
        8. 5.2.2.8 Choose Soft Start Capacitor
      3. 5.2.3 Application Curves (QFN)
  6. 6Power Supply Recommendations
  7. 7Layout
    1. 7.1 Layout Guidelines
    2. 7.2 Layout Example
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

7.3 Trademarks

DCAP is a trademark of Texas Instruments.

7.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

7.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.