SLVSB04A July   2011  – August 2015 TPS65186

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  VPOS/VNEG Supply Tracking
      5. 8.3.5  V3P3 Power Switch
      6. 8.3.6  VCOM Adjustment
        1. 8.3.6.1 Kick-Back Voltage Measurement
        2. 8.3.6.2 Storing the VCOM Power-Up Default Value in Memory
      7. 8.3.7  Fault Handling and Recovery
      8. 8.3.8  Power Good Pin
      9. 8.3.9  Interrupt Pin
      10. 8.3.10 Panel Temperature Monitoring
        1. 8.3.10.1 NTC Bias Circuit
        2. 8.3.10.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.10.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE)
      2. 8.6.2  Enable (ENABLE)
      3. 8.6.3  Voltage Adjustment Register (VADJ)
      4. 8.6.4  VCOM 1 (VCOM1)
      5. 8.6.5  VCOM 2 (VCOM2)
      6. 8.6.6  Interrupt Enable 1 (INT_EN1)
      7. 8.6.7  Interrupt Enable 2 (INT_EN2)
      8. 8.6.8  Interrupt 1 (INT1)
      9. 8.6.9  Interrupt 2 (INT2)
      10. 8.6.10 Power Up Sequence Register 0 (UPSEQ0)
      11. 8.6.11 Power Up Sequence Register 1 (UPSEQ1)
      12. 8.6.12 Power Down Sequence Register 0 (DWNSEQ0)
      13. 8.6.13 Power Down Sequence Register 1 (DWNSEQ1)
      14. 8.6.14 Thermistor Register 1 (TMST1)
      15. 8.6.15 Thermistor Register 2 (TMST2)
      16. 8.6.16 Power Good Status (PG)
      17. 8.6.17 Revision and Version Control (REVID)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

  1. PBKG (Die substrate) must connect to VN (–16 V) with short, wide trace. Wide copper trace will improve heat dissipation.
  2. PowerPad is internally connected to PBKG and must not be connected to ground, but connected to VN with a short wide copper trace.
  3. Inductor traces must be kept on the PCB top layer free of any vias.
  4. Feedback traces must be routed away from any potential noise source to avoid coupling.
  5. Output caps must be placed immediately at output pin.
  6. Vin pins must be bypassed to ground with low ESR ceramic bypass capacitors.

11.2 Layout Example

TPS65186 layout_ex_slvsb04.pngFigure 33. Layout Diagram