SLVSB04A July   2011  – August 2015 TPS65186

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  VPOS/VNEG Supply Tracking
      5. 8.3.5  V3P3 Power Switch
      6. 8.3.6  VCOM Adjustment
        1. 8.3.6.1 Kick-Back Voltage Measurement
        2. 8.3.6.2 Storing the VCOM Power-Up Default Value in Memory
      7. 8.3.7  Fault Handling and Recovery
      8. 8.3.8  Power Good Pin
      9. 8.3.9  Interrupt Pin
      10. 8.3.10 Panel Temperature Monitoring
        1. 8.3.10.1 NTC Bias Circuit
        2. 8.3.10.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.10.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE)
      2. 8.6.2  Enable (ENABLE)
      3. 8.6.3  Voltage Adjustment Register (VADJ)
      4. 8.6.4  VCOM 1 (VCOM1)
      5. 8.6.5  VCOM 2 (VCOM2)
      6. 8.6.6  Interrupt Enable 1 (INT_EN1)
      7. 8.6.7  Interrupt Enable 2 (INT_EN2)
      8. 8.6.8  Interrupt 1 (INT1)
      9. 8.6.9  Interrupt 2 (INT2)
      10. 8.6.10 Power Up Sequence Register 0 (UPSEQ0)
      11. 8.6.11 Power Up Sequence Register 1 (UPSEQ1)
      12. 8.6.12 Power Down Sequence Register 0 (DWNSEQ0)
      13. 8.6.13 Power Down Sequence Register 1 (DWNSEQ1)
      14. 8.6.14 Thermistor Register 1 (TMST1)
      15. 8.6.15 Thermistor Register 2 (TMST2)
      16. 8.6.16 Power Good Status (PG)
      17. 8.6.17 Revision and Version Control (REVID)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (July 2011) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed ROUT from “TBD” to “5 Ω”Go