SBVS338G March   2020  – May 2022 TPS7A20

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Output Noise
      2. 7.3.2 Smart Enable
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Foldback Current Limit
      5. 7.3.5 Undervoltage Lockout (UVLO)
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Active Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Undervoltage Lockout (UVLO) Operation
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
        2. 8.1.5.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at operating temperature range (TJ = –40℃ to +125℃), VIN = VOUT(NOM) + 0.3 V or 1.6V, whichever is greater, VEN = 1.0 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF (unless otherwise noted); all typical values are at TJ = 25℃
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ΔVOUT Output voltage tolerance VIN = (VOUT(NOM) + 0.3 V) to 6.0 V,
IOUT = 1 mA to 300 mA, 
VOUT ≥ 1.85 V (DQN, YCJ, YCK packages)		 –1.5 1.5 %
VIN = (VOUT(NOM) + 0.3 V) to 6.0 V,
IOUT = 1 mA to 300 mA, 
VOUT ≥ 2.8 V (DBV package)		 -1.5 1.5
VIN = (VOUT(NOM) + 0.5 V) to 6.0 V,
IOUT = 1 mA to 300 mA
VOUT < 1.85 V (DQN, YCJ, YCK packages)		 –30 30 mV
VIN = (VOUT(NOM) + 0.3 V) to 6.0 V,
IOUT = 1 mA to 300 mA, 
VOUT < 2.8 V (DBV package)		 -40 40
ΔVOUT Line regulation VIN = (VOUT(NOM) + 0.3 V) to 6.0 V,
IOUT = 1 mA		 0.03 %/V
ΔVOUT Load regulation IOUT = 1 mA to 300 mA  (DQN, YCJ, YCK packages) 13 mV
IOUT = 1 mA to 300 mA (DBV package) 19
IGND Quiescent ground current VEN = VIN = 6 V,
IOUT = 0 mA		 TJ = 25°C 6.5 8.5 µA
TJ = –40°C to 85°C 10
TJ = –40°C to 125°C 15
VEN = VIN = 6 V, IOUT = 300 mA 2000
ISHDN Shutdown ground current VEN = 0 V (disabled), VIN = 6.0 V, TJ = 25°C 0.07 0.2 µA
IGND(DO) IGND in dropout VIN ≤  VOUT(NOM) , IOUT = 0 mA, VEN = VIN 6.5 15 µA
VDO Dropout voltage IOUT = 300 mA,
VOUT = 95% x VOUT(NOM),
(DQN, YCJ,  YCK packages unless otherwise noted)		 0.8 V ≤ VOUT < 1.0 V(1) 690 mV
1.0 V ≤ VOUT < 1.2 V(1) 490
1.2 V ≤ VOUT < 1.5 V(1) 355
1.5 V ≤ VOUT < 2.5 V 200
1.5 V ≤ VOUT < 2.5 V (DBV) 205
2.5 V ≤ VOUT < 5.5 V 140
2.5 V ≤ VOUT < 5.5 V (DBV) 145
ICL  Output current limit VOUT = 0.9 x VOUT(NOM), 
VIN = VOUT(NOM) + 0.5 V 		 VOUT < 1.5 V  (YCJ, YCK packages) 360 520 770 mA
VOUT = 0.9 x VOUT(NOM), 
VIN = VOUT(NOM) + 0.5 V 		 VOUT < 1.5 V  (DQN package) 360 520 730
VOUT = VOUT(NOM) - 150 mV,
VIN = VOUT(NOM) + 0.5 V 		 VOUT < 1.5 V (DBV package) 360 520 730
VOUT = 0.9 x VOUT(NOM), 
VIN = VOUT(NOM) + 0.3 V 		 VOUT ≥ 1.5 V (YCJ, YCK packages) 360 520 770
VOUT = 0.9 x VOUT(NOM), 
VIN = VOUT(NOM) + 0.3 V 		 VOUT ≥ 1.5 V (DQN package) 360 520 730
ISC Short-circuit current limit VOUT = 0 V 160 mA
PSRR Power-supply rejection ratio IOUT = 20 mA,
VIN = VOUT + 1.0 V		 f = 100 Hz 95 dB
f = 1 kHz 95
f = 10 kHz 75
f = 100 kHz 75
f = 1 MHz 45
IOUT = 300 mA,
VIN = VOUT + 1.0 V		 f = 100 Hz 65
f = 1 kHz 92
f = 10 kHz 75
f = 100 kHz 60
f = 1 MHz 40
VN Output noise voltage BW = 10 Hz to 100 kHz,
VOUT = 2.8 V		 IOUT = 300 mA 7 µVRMS
IOUT = 1 mA 10
RPULLDOWN Output automatic discharge pulldown resistance VEN < VEN(LOW) (output disabled), VIN = 3.1 V 150 Ω
TSD Thermal shutdown TJ rising 165 °C
TJ falling 140
VEN(LOW)  Low input threshold VIN = 1.6 V to 6.0 V,
VEN falling until the output is disabled		 0.3 V
VEN(HI)  High input threshold VIN = 1.6 V to 6.0 V
VEN rising until the output is enabled		 0.9 V
VUVLO UVLO threshold VIN rising (YCJ and YCK packages) 1.11 1.35 1.59 V
VIN rising (DBV and DQN packages) 1.17 1.35 1.59
VIN falling (YCJ and YCK packages) 1.05 1.3 1.55
VIN falling (DBV and DQN packages) 1.11 1.3 1.55
VUVLO(HYST) UVLO hysteresis 50 mV
IEN EN input leakage current VEN = 6.0 V and VIN = 6.0 V 90 250 nA
REN(PULL-DOWN) Smart enable pulldown resistor VEN = 0.25 V 500 KΩ
(1) Design simulation data only