SLVSAZ9D June   2012  – February 2018 TPS81256

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application
      2.      Efficiency vs Load Current
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operation
      2. 8.3.2 Power-Save Mode
      3. 8.3.3 Current Limit Operation, Maximum Output Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Softstart, Enable
      2. 8.4.2 Load Disconnect and Reverse Current Protection
      3. 8.4.3 Undervoltage Lockout
      4. 8.4.4 Thermal Regulation
      5. 8.4.5 Thermal Shutdown
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Capacitor Selection CEXT
        2. 9.2.2.2 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Surface Mount Information
    4. 11.4 Thermal and Reliability Information
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIP|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Minimum and maximum values are at VIN = 2.5V to 5.5V, VOUT = 5.0V (or VIN, whichever is higher), EN = 1.8V, TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT = 5.0V, EN = 1.8V, TA = 25°C (unless otherwise noted).
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY CURRENT
IQ Operating quiescent current into VIN(1) IOUT = 0mA, VOUT = 5.0V, VIN = 3.6V
EN = VIN
Device not switching
30 50 µA
Operating quiescent current into VOUT(1) 7 20 µA
ISD Shutdown current(1) EN = GND 0.85 5.0 μA
VUVLO Under-voltage lockout threshold Falling 2.0 2.1 V
Hysteresis 0.1 V
ENABLE
VIL Low-level input voltage 0.4 V
VIH High-level input voltage 1.0 V
Ilkg Input leakage current Input connected to GND or VIN 0.5 µA
OUTPUT
VOUT Regulated DC output voltage 2.5V ≤ VIN ≤ 4.85V, IOUT = 0mA
PWM operation. Open Loop
4.92 5 5.08 V
3.3V ≤ VIN ≤ 4.85V, 0mA ≤ IOUT ≤ 550mA
PFM/PWM operation
4.85 5 5.2 V
2.9V ≤ VIN ≤ 4.85V, 0mA ≤ IOUT ≤ 450mA
PFM/PWM operation
4.85 5 5.2 V
ΔVOUT Power-save mode output ripple voltage PFM operation, IOUT = 1mA 35 mVpk
PWM mode output ripple voltage PWM operation, IOUT = 200mA 8 mVpk
POWER SWITCH
rDS(on) Input-to-output On-resistance VI = 5.25 V. Device not switching 320
Ilkg Reverse leakage current into VOUT(1) EN = GND 5 µA
ILIM Average input current limit EN = VIN. VIN = 3.3V 1180 mA
Overtemperature protection 140 °C
Overtemperature hysteresis 20 °C
OSCILLATOR
fOSC Oscillator frequency VIN = 3.6V, VOUT = 5.0V, IOUT = 500mA 4 MHz
TIMING
Start-up time IOUT = 0mA
Time from active EN to start switching
70 µs
IOUT = 0mA
Time from active EN to VOUT
400 µs
Maximum values can vary over lifetime due to intrinsic capacitor ageing effects. For more details, refer to Thermal and Reliability Information section.