SLUSAN7C SEPTEMBER   2011  – April  2018 TPS84210

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Package Specifications
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics
    6. 6.6 Typical Characteristics (VIN = 5 V)
    7. 6.7 Typical Characteristics (VIN = 3.3 V)
  7. 7 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjusting The Output Voltage
  9. 9 Capacitor Recommendations For The TPS84210 Power Supply
    1. 9.1 Capacitor Technologies
      1. 9.1.1 Electrolytic, Polymer-Electrolytic Capacitors
      2. 9.1.2 Ceramic Capacitors
      3. 9.1.3 Tantalum, Polymer-Tantalum Capacitors
    2. 9.2 Input Capacitor
    3. 9.3 Output Capacitor
  10. 10Transient Response
  11. 11Application Schematics
  12. 12Power Good (PWRGD)
  13. 13Power-Up Characteristics
  14. 14Remote Sense
  15. 15Output On/Off Inhibit (INH)
  16. 16Slow Start (SS/TR)
  17. 17Overcurrent Protection
  18. 18Synchronization (CLK)
  19. 19Sequencing (SS/TR)
  20. 20Programmable Undervoltage Lockout (UVLO)
  21. 21Thermal Shutdown
  22. 22Layout Guidelines
  23. 23Layout Example
  24. 24EMI
  25. 25Device and Documentation Support
    1. 25.1 Receiving Notification of Documentation Updates
    2. 25.2 Community Resources
    3. 25.3 Trademarks
    4. 25.4 Electrostatic Discharge Caution
    5. 25.5 Glossary
  26. 26Mechanical, Packaging, and Orderable Information
    1. 26.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKG|39
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings(1)

over operating temperature range (unless otherwise noted)
MIN MAX UNIT
Input Voltage VIN, PWRGD –0.3 7 V
INH/UVLO, RT/CLK –0.3 3.3 V
SS/TR, STSEL, VADJ –0.3 3 V
SENSE+ VADJ rating must also be met -0.3 VOUT V
Output Voltage PH –0.6 7 V
PH 10 ns Transient –2 7 V
VOUT -0.6 VIN V
VDIFF (GND to exposed thermal pad) –0.2 0.2 V
Source Current RT/CLK, INH/UVLO ±100 µA
PH Current Limit A
Sink Current PH Current Limit A
SS/TR ±100 µA
PWRGD 10 mA
Operating Junction Temperature(2) –40 125(2) °C
Storage Temperature –65 150 °C
Peak Reflow Case Temperature(3) 250(4) °C
Maximum Number of Reflows Allowed(3) 3(4)
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 1500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See the temperature derating curves in the Typical Characteristics section for thermal information.
(3) For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note.
(4) Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240°C with a maximum of one reflow.