SNVS901A March   2014  – May 2014 TPS92511

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Pulse Level Modulation (PLM) Control
      2. 7.3.2  Pulse Level Modulation (PLM) Operaion Principles
      3. 7.3.3  PLM Control enable Common-Anode Low-Side Sensing (CALS)Technique to Save Wiring
      4. 7.3.4  Internal Regulator
      5. 7.3.5  Setting The Switching Frequency
      6. 7.3.6  Setting The LED Current
      7. 7.3.7  Integrated MOSFET
      8. 7.3.8  Inductor Selection
      9. 7.3.9  Integrated MOSFET Current Limit
      10. 7.3.10 PWM Dimming Control
      11. 7.3.11 Analog Dimming
      12. 7.3.12 High Voltage Buck Configuration
      13. 7.3.13 Thermal Foldback
      14. 7.3.14 EMI Consideration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN < 4.5 V (minimum VIN)
      2. 7.4.2 Operation with DIM control
      3. 7.4.3 Linear Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 TPS92511 LED driver for 12 LEDs at 0.5A
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Thermal Consideration
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Trademarks

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.