SCDS324E August   2011  – Oct 2019 TS3DS10224

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    6. 6.6  Electrical Characteristics: Fan-Out 1:2 Configurations
    7. 6.7  Switching Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    8. 6.8  Switching Characteristics: Fan-Out 1:2 Configurations
    9. 6.9  Dynamic Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    10. 6.10 Dynamic Characteristics: Fan-Out 1:2 Configurations
    11. 6.11 Typical Characteristics
      1. 6.11.1 Single-Channel 1:4 or Dual-Channel 1:2 Configurations
      2. 6.11.2 Fan-Out 1:2 Configurations
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Differential Crosspoint Switch
      3. 8.4.3 2-Channel 1:2 Mux
      4. 8.4.4 1-Channel 1:4 Mux
      5. 8.4.5 Fan-Out 1:2 Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1-Channel Differential 1:4 Mux
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 2-Channel Differential Crosspoint Switch
        1. 9.2.2.1 Design Requirements
      3. 9.2.3 Fan-Out Switch
        1. 9.2.3.1 Design Requirements
      4. 9.2.4 2-Channel Differential 1:2 SPDT Switch
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TS3DS10224 UNIT
RUK (WQFN)
20 PINS
RθJA Junction-to-ambient thermal resistance 45.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.8 °C/W
RθJB Junction-to-board thermal resistance 17.1 °C/W
ψJT Junction-to-top characterization parameter 0.6 °C/W
ψJB Junction-to-board characterization parameter 17.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.