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Product details

Parameters

Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels (#) 2 Bandwidth (MHz) 500 Supply voltage (Max) (V) 3.6 Supply voltage (Min) (V) 3 Ron (Typ) (Ohms) 13 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 3.6 Supply current (Typ) (uA) 50 ESD HBM (Typ) (kV) 2.5 Operating temperature range (C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 ICC (Typ) (uA) 50 Input/output continuous current (Max) (mA) 100 COFF (Typ) (pF) 6 CON (Typ) (pF) 12 Off isolation (Typ) (dB) -30 OFF-state leakage current (Max) (µA) 5 Propagation delay (ns) 0.05 Ron (Max) (Ohms) 19 Ron channel match (Max) (Ohms) 2.5 RON flatness (Typ) (Ohms) 4 Turn off time (disable) (Max) (ns) 100 Turn on time (enable) (Max) (ns) 30 VIH (Min) (V) 2.3 VIL (Max) (V) 0.6 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

WQFN (RUK) 20 9 mm² 3 x 3 open-in-new Find other Protocol-specific switches & muxes

Features

  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)

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Description

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 3
Type Title Date
* Datasheet TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E) Oct. 17, 2019
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM136.ZIP (511 KB) - HSpice Model
SIMULATION MODEL Download
SCDM137.ZIP (511 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
WQFN (RUK) 20 View options

Ordering & quality

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  • Qualification summary
  • Ongoing reliability monitoring

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