SCDS187C FEBRUARY 2005 – August 2018 TS5A3167
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TS5A3167 | UNIT | |||
---|---|---|---|---|---|
DBV (SOT-23) | DCK (SOT-23) | YZP (DSBGA) | |||
5 PINS | 5 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 230.3 | 268.0 | 146.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 111.9 | 171.8 | 1.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 69.5 | 64.5 | 39.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 33.0 | 40.5 | 0.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 69.0 | 62.9 | 39.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |