SLLSF47D February   2018  – April 2024 TUSB1044

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 USB 3.1
      2. 6.3.2 DisplayPort
      3. 6.3.3 4-Level Inputs
      4. 6.3.4 Receiver Linear Equalization
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Configuration in GPIO mode
      2. 6.4.2 Device Configuration in I2C Mode
      3. 6.4.3 DisplayPort Mode
      4. 6.4.4 Custom Alternate Mode
      5. 6.4.5 Linear EQ Configuration
      6. 6.4.6 Adjustable VOD Linear Range and DC Gain
      7. 6.4.7 USB3.1 Modes
    5. 6.5 Programming
      1. 6.5.1 Use The Following Procedure to Write to TUSB1044 I2C Registers:
      2. 6.5.2 Use The Following Procedure to Read the TUSB1044 I2C Registers:
      3. 6.5.3 Use The Following Procedure for Setting a Starting Sub-Address for I2C Reads:
    6. 6.6 Register Maps
      1. 6.6.1 TUSB1044 Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 System Examples
      1. 7.3.1 USB 3.1 only (USB/DP Alternate Mode)
      2. 7.3.2 USB3.1 and 2 lanes of DisplayPort
      3. 7.3.3 DisplayPort Only
      4. 7.3.4 USB 3.1 only (USB/Custom Alternate Mode)
      5. 7.3.5 USB3.1 and 1 Lane of Custom Alt Mode
      6. 7.3.6 USB3.1 and 2 Lane of Custom Alt Mode
      7. 7.3.7 USB3.1 and 4 Lane of Custom Alt Mode
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.1 Layout Guidelines

  1. RXP/N and TXP/N pairs should be routed with controlled 90-Ω differential impedance (± 15%).
  2. Keep away from other high speed signals.
  3. Intra-pair routing should be kept to within 2 mils.
  4. Length matching should be near the location of mismatch.
  5. Each pair should be separated at least by 3 times the signal trace width.
  6. The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This will minimize any length mismatch causes by the bends and therefore minimize the impact bends have on EMI.
  7. Route all differential pairs on the same of layer.
  8. The number of VIAS should be kept to a minimum. It is recommended to have no more than 1 VIA between TUSB1044 and Type-C connector and no more than 1 VIA between TUSB1044 and USB3.1 Device/Host.
  9. Keep traces on layers adjacent to ground plane.
  10. Do NOT route differential pairs over any plane split.
  11. Adding Test points will cause impedance discontinuity; and therefore, negatively impacts signal performance. If test points are used, the test points should be placed in series and symmetrically. The test points must not be placed in a manner that causes a stub on the differential pair.
  12. Assuming 1 dB/inch loss at 5 GHz, the trace length between TUSB1044 and Type-C connector should be no more than 1.5 inches.
  13. Assuming 1 dB/inch loss at 5 GHz, the trace length between TUSB1044 and the USB 3.1 Host/Device should be no more than 8 inches.
  14. ESD protection devices and EMI suppression devices need to be carefully selected and have to have excellent transient performance at 10 Gbps with flat shunt capacitance characteristics over ±650 mV voltage range. Note small-signal insertion loss characteristics are insufficient to determine suitability of non-linear devices (ESD devices) for 10Gbps operation