SLUSBY6B August   2015  – March 2017 UCC27714

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD and Under Voltage Lockout
      2. 7.3.2 Input and Output Logic Table
      3. 7.3.3 Input Stage
      4. 7.3.4 Output Stage
      5. 7.3.5 Level Shift
      6. 7.3.6 Low Propagation Delays and Tightly Matched Outputs
      7. 7.3.7 Parasitic Diode Structure in UCC27714
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Function
      2. 7.4.2 Minimum Input Pulse Operation
      3. 7.4.3 Operation with HO and LO Outputs High Simultaneously
      4. 7.4.4 Operation Under 100% Duty Cycle Condition
      5. 7.4.5 Operation Under Negative HS Voltage Condition
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
        2. 8.2.2.2 Selecting Bootstrap Capacitor (CBOOT)
        3. 8.2.2.3 Selecting VDD Bypass/Holdup Capacitor (CVDD) and Rbias
        4. 8.2.2.4 Selecting Bootstrap Resistor (RBOOT)
        5. 8.2.2.5 Selecting Gate Resistor RHO/RLO
        6. 8.2.2.6 Selecting Bootstrap Diode
        7. 8.2.2.7 Estimate the UCC27714 Power Losses (PUCC27714)
        8. 8.2.2.8 Application Example Schematic Note
        9. 8.2.2.9 LO and HO Overshoot and Undershoot
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 12.6 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
    5. 11.5 Receiving Notification of Documentation Updates
    6. 11.6 Community Resources
  12. 12Mechanical, Packaging, and Orderable Information
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from A Revision (August 2015) to B Revision

  • Changed MAX Supply voltage from 18 V to 17 V.Go
  • Changed MAX Driver bootstrap voltage from 18 V to 17 V.Go
  • Changed MAX Bootstrap pin voltage from 18 V to 17 V.Go
  • Changed MAX Input voltage with respect to VSS from 18 V to 17 V. Go
  • Added 40 ns NOM to tON Timing Requirements.Go
  • Added 40 ns NOM to tOFF Timing Requirements. Go
  • Deleted 18-V reference from all Typical Characteristics images.Go
  • Changed Negative Voltage Chart Time vs Negative Voltage image. Go
  • Added Increase RHO and RLO, Reduce HS dV/dt image and description. Go
  • Added LO and HO Overshoot and Undershoot section.Go

Changes from * Revision (August, 2015) to A Revision

  • Changed marketing status from Product preview to Final. Go