SLUSDR3B June   2019  – February 2024 UCC5390-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Function
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications for DWV Package
    7. 5.7  Safety-Related Certifications For DWV Package
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Propagation Delay, Inverting, and Noninverting Configuration
      1. 6.1.1 CMTI Testing
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply
      2. 7.3.2 Input Stage
      3. 7.3.3 Output Stage
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Undervoltage Lockout (UVLO)
        2. 7.3.4.2 Active Pulldown
        3. 7.3.4.3 Short-Circuit Clamping
    4. 7.4 Device Functional Modes
      1. 7.4.1 ESD Structure
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Designing IN+ and IN– Input Filter
        2. 8.2.2.2 Gate-Driver Output Resistor
        3. 8.2.2.3 Estimate Gate-Driver Power Loss
        4. 8.2.2.4 Estimating Junction Temperature
      3. 8.2.3 Selecting VCC1 and VCC2 Capacitors
        1. 8.2.3.1 Selecting a VCC1 Capacitor
        2. 8.2.3.2 Selecting a VCC2 Capacitor
        3. 8.2.3.3 Application Circuits With Output Stage Negative Bias
      4. 8.2.4 Application Curve
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PCB Material
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Certifications
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

VCC1 = 3.3 V or 5 V, 0.1-µF capacitor from VCC1 to GND1, VCC2= 15 V, 1-µF capacitor from VCC2 to VEE2, CLOAD = 1 nF, TJ = –40°C to +125°C, (unless otherwise noted)

GUID-A0399537-046F-4504-A600-9A092FC1DEEB-low.gif
CLOAD = 150 nF
Figure 5-3 Output-High Drive Current vs Output Voltage
GUID-84AB1416-3710-4029-8929-C53B8FB6B631-low.gif
IN+ = L IN– = H
Figure 5-5 ICC1 Supply Current vs Temperature
GUID-A02D14A6-24D7-4370-86CE-8AB17962D542-low.gif
Duty Cycle = 50% T = 25°C
Figure 5-7 ICC1 Supply Current vs Input Frequency
GUID-D78CD34B-E628-4C88-B6E9-0A87818AA2A0-low.gif
IN+ = H IN– = L
Figure 5-9 ICC2 Supply Current vs Temperature
GUID-BDE6FE48-AF8B-416D-BEDE-1D3315AD34EB-low.gif
fSW = 1 kHz
Figure 5-11 ICC2 Supply Current vs Load Capacitance
GUID-8DFFE244-6404-46C6-A7D9-C81C0A928DD9-low.gif
Figure 5-13 Fall Time vs Temperature
GUID-78FFA767-0989-4384-921C-41ABDB39FC83-low.gif
Figure 5-15 Propagation Delay tPHL vs Temperature
GUID-C2B25338-75FD-4455-BA58-9C6795A52E33-low.gif
fSW = 1 kHz RGH = 0 Ω RGL = 0 Ω
Figure 5-17 Fall Time vs Load Capacitance
GUID-473699E6-9360-4CCF-9E1E-F28029539466-low.gif
CLOAD = 150 nF
Figure 5-4 Output-Low Drive Current vs Output Voltage
GUID-7DFC8D42-56D1-4328-AAC6-4DCA296F7E15-low.gif
IN+ = H IN– = L
Figure 5-6 ICC1 Supply Current vs Temperature
GUID-A4C5C042-1A34-4652-BA70-E0343D6E86C7-low.gif
IN+ = L IN– = H
Figure 5-8 ICC2 Supply Current vs Temperature
GUID-8BAA8C8E-EDFC-485D-B8F2-EDE2AF2BA549-low.gif
Duty Cycle = 50% T = 25°C
Figure 5-10 ICC2 Supply Current vs Input Frequency
GUID-C223E78B-B4B5-4B4D-8185-2A09AB090B95-low.gif
Figure 5-12 Rise Time vs Temperature
GUID-25F01718-244B-4B5F-96A6-0617F1AC7977-low.gif
Figure 5-14 Propagation Delay tPLH vs Temperature
GUID-85F527DC-A291-4C5F-8FEF-16CF7D174C3C-low.gif
fSW = 1 kHz RGH = 0 Ω RGL = 0 Ω
Figure 5-16 Rise Time vs Load Capacitance