SWRS152O June   2013  – January 2026 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  External Digital Slow Clock Requirements
    5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 7.8  WLAN Performance: Currents
    9. 7.9  Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    10. 7.10 Bluetooth Performance: Transmitter, BR
    11. 7.11 Bluetooth Performance: Transmitter, EDR
    12. 7.12 Bluetooth Performance: Modulation, BR
    13. 7.13 Bluetooth Performance: Modulation, EDR
    14. 7.14 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
    15. 7.15 Bluetooth Low Energy Performance: Transmitter Characteristics
    16. 7.16 Bluetooth Low Energy Performance: Modulation Characteristics
    17. 7.17 Bluetooth BR and EDR Dynamic Currents
    18. 7.18 Bluetooth Low Energy Currents
    19. 7.19 Timing and Switching Characteristics
      1. 7.19.1 Power Management
        1. 7.19.1.1 Block Diagram – Internal DC-DCs
      2. 7.19.2 Power-Up and SHUTDOWN States
      3. 7.19.3 Chip Top-level Power-Up Sequence
      4. 7.19.4 WLAN Power-Up Sequence
      5. 7.19.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
      6. 7.19.6 WLAN SDIO Transport Layer
        1. 7.19.6.1 SDIO Timing Specifications
        2. 7.19.6.2 SDIO Switching Characteristics – High Rate
      7. 7.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 7.19.7.1 UART 4-Wire Interface – H4
      8. 7.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 8 Detailed Description
    1. 8.1 WLAN Features
    2. 8.2 Bluetooth Features
    3. 8.3 Bluetooth Low Energy Features
    4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
    5. 8.5 Module Markings
    6. 8.6 Test Grades
    7. 8.7 End Product Labeling
    8. 8.8 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application – WL1835MODGB Reference Design
      2. 9.1.2 Design Recommendations
      3. 9.1.3 RF Trace and Antenna Layout Recommendations
      4. 9.1.4 Module Layout Recommendations
      5. 9.1.5 Thermal Board Recommendations
      6. 9.1.6 Baking and SMT Recommendations
        1. 9.1.6.1 Baking Recommendations
        2. 9.1.6.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Tools and Software
      3. 10.1.3 Device Support Nomenclature
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)

10.1 Device Support