WiLink™ 8 industrial Wi-Fi, Bluetooth & Bluetooth Smart (Low energy) module
Product details
Parameters
Package | Pins | Size
Features
- General
- Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management
- Quick Hardware Design With TI Module Collateral and Reference Designs
- Operating Temperature: –20°C to +70°C
- Small Form Factor: 13.3 × 13.4 × 2 mm
- 100-Pin MOC Package
- FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas
- Wi-Fi®
- WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11b, 802.11g, and 802.11n
- 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
- 2.4-GHz MRC Support for Extended Range
- Fully Calibrated: Production Calibration Not Required
- 4-Bit SDIO Host Interface Support
- Wi-Fi Direct Concurrent Operation (Multichannel, Multirole)
- Bluetooth® and Bluetooth low energy (WL183xMOD Only)
- Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032799)
- Host Controller Interface (HCI) Transport for Bluetooth Over UART
- Dedicated Audio Processor Support of SBC Encoding + A2DP
- Dual-Mode Bluetooth and Bluetooth Low Energy
- TI’s Bluetooth- and Bluetooth Low Energy-Certified Stack
- Key Benefits
- Reduces Design Overhead
- Differentiated Use Cases by Configuring WiLink™ 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks)
- Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4× the Range Versus One Antenna
- Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step
- Lowest Wi-Fi Power Consumption in Connected Idle (< 800 µA)
- Configurable Wake on WLAN Filters to Only Wake Up the System
- Wi-Fi-Bluetooth Single Antenna Coexistence
All trademarks are the property of their respective owners.
Description
The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux®and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.
Technical documentation
= Top documentation for this product selected by TI
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
TMDSEVM437X
Description
TMDXEVM437XH is a high security evaluation module (EVM) that enables developers to evaluate secure boot functionality, including signing and encryption on high security AM437x devices.
This is a socketed EVM that includes an AM437x high security device and TI development key for evaluating secure (...)
Features
- Hardware
- AM437x Arm® Cortex-A9 processor with secure boot
- 2GB DDR3
- TPS65218 power management IC
- 7" capacitive touch screen LCD
- 2 camera modules
- On board NAND and eMMC memory
- Connector for WiLink™ 8 solutions
- Software
- Processor SDK (Linux and TI-RTOS)
- Connectivity
- Gigabit Ethernet (1)
- UART (1)
- Micro SD/MMC (1)
- (...)
TMDSEVM572X
Description
The AM572x evaluation module provides an affordable platform to quickly start evaluation of Sitara™ Arm® Cortex®-A15 AM57x processors (AM5728, AM5726, AM5718, AM5716) and accelerate development for HMI, machine vision, networking, medical imaging and many other industrial applications. It is a (...)
Features
Hardware
- AM5728 processor
- 2GB DDR3L
- TPS659037 power management IC
- 7" WVGA capacitive touch screen LCD
- 3MP camera module (not included, it needs to be ordered here https://www.ti.com/tool/TMDSCM572X )
- 4GB eMMC
Software
- Linux
- TI-RTOS
Connectivity
- Gigabit Ethernet (2)
- Mini PCIe
- e/mSATA
- Micro SD card
- Micro USB 2.0
- USB (...)
TMDXEVM3358
Description
Features
Hardware
- AM3358 Arm processor
- 1GB DDR3
- TPS65910 power management IC
- 7” touch screen LCD
Software
- Processor SDK
Connectivity
- 10/100 Ethernet (1)
- UART (4)
- SD/MMC (2)
- USB2.0 OTG/HOST (1/1)
- Audio in/out
- JTAG
- CAN (2)
WL18XXCOM82SDMMC
Description
The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)
Features
- Easy to connect WiLink8 modules to platforms over SDMMC
- 3v level-shifter to 1.8v IO
- BT and WiFi debug pins
Description
TI WiLink™ 8 module family
The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.
The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)
Features
- WLAN, Bluetooth, BLE on a module board
- 100-pin board card
- Dimension 76.0 mm(L) x 31.0 mm(W)
- WLAN 2.4 GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)
- Support for Bluetooth & BLE dual mode
- Seamless integration with TI Sitara and other application processors
- Design for TI AM335X (...)
Description
TI WiLink™ 8 module family The WL1837MODCOM8I is one of the two evaluation boards for the TI WiLink™ 8 combo module family. For designs requiring performance in the 2.4 GHz band only, see the WL1835MODCOM8.
The WL1837MODCOM8I, which is compatible with many processors including TI’s (...)
Features
- WLAN, Bluetooth 4.1, BLE on a module board
- 100-pin board card
- Dimension 76.0 mm(L) x 31.0 mm(W)
- WLAN 2.4 & 5 GHz SISO (20- and 40- MHz channels), 2.4 GHz MIMO (20-MHz channels)
- Support for Bluetooth & BLE dual mode
- Seamless integration with TI Sitara and other application processors
- Design for TI AM335x (...)
Software development
PROCESSOR-SDK-AM335X — Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
Features
Linux features
- Open Linux support
- Linux kernel and Bootloaders
- File system
- Qt/Webkit application framework
- 3D graphics support
- Integrated WLAN and Bluetooth® support
- GUI-based application launcher
- Example applications, including:
- ARM benchmarks: Dhrystone, Linpack, Whetstone
- Webkit web browser
- Soft Wifi access (...)
WILINK-BT_WIFI-WIRELESS_TOOLS — This package includes the following applications:
- WLAN Real-Time Tuning Tool (RTTT)
- Bluetooth® Logger
- WLAN gLogger
- Link Quality Monitor (LQM)
- HCITester Tool
- BTSout
- BTSTransform
- ScriptPad
The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)
WILINK-WIFI_MESH_VISUALIZATION_TOOL — Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Features
- Network discovery capability over DHCP or MDNS
- Mesh visualization capabilities and data on each one of the nodes
- Path selection visualization
TI-BT-4-2-STACK-LINUX-ADDON — This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
Features
- Dual mode Classic Bluetooth (BR/EDR) and Bluetooth Low Energy (BLE) Stack
- Bluetooth Core Specification v4.2
- Platform Manager Framework to enable multiple client applications to use the stack.
- User space applications and stack that do not require specific kernel modules.
- Compiled with Linaro GCC 4.7 (...)
TI-BT-STACK-LINUX-ADDON — This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Features
- Dual mode Classic Bluetooth (BR/EDR) and Bluetooth Low Energy (BLE) Stack
- Bluetooth Core Specification v4.0
- Platform Manager framework to enable multiple client applications to use the stack
- Integrated with TI Shared Transport driver (available from Linux 3.8)
- Plug-in for GStreamer (Open Source Audio (...)
WILINK8-WIFI-MCP8 —
The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)
Features
- IEEE 802.11 a,b,g,n, 2X2 MIMO @ 2.4GHz and 5GHz
- Modes: STA, AP, P2P, WiFi Direct
- TP: 100Mbps UDP
- Security: WMM-PS, WMM-AC, WPA/2PSK, Ent,WPS,WPSv2
- SW Features :
- Multi Role Multi Channel : concurrent operation of 2 WLAN roles on a single device.
- Coex: with BT/BLE at 2.4GHz.
- DFS Master: radar detection at (...)
WILINK8-WIFI-NLCP —
WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide
Software block overview:
WL18xx Linux driver uses the open source components along with the interface (...)
Features
- Linux open-source Wi-Fi package.
- TI NLCP releases are Wi-Fi Alliance pre-certified.
- IEEE: 802.11 a,b,g,n, 2X2 MIMO @ 2.4 GHz and antenna diversity @ 5 GHz
- Supported Modes: STA, AP, P2P, Wi-Fi Direct, Wi-Fi Mesh
- Up to 100 Mbps UDP throughput
- Security: WPA3, WMM-PS, WMM-AC, WPA/2PSK, Ent,WPS,WPSv2
- Low power (...)
WL18XX-BT-SP —
The Bluetooth Service Pack is composed of the following four files:
- BTS file (TIInit_11.8.32.bts)
- ILI file (TIInit_11.8.32.ili)
- XML (TIInit_11.8.32.xml)
- Release Notes Document
- License Agreement
Note the version in the file name is unique for combination of hardware and firmware, but is not updated per (...)
Features
- Classic Bluetooth and Bluetooth Low Energy
- Sleep Enabled
Design tools & simulation
WILINK-DESIGN-REVIEWS — To get started with the WiLink™ hardware design review process:
- Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see WL18xx product page links below).
- Step 2: Download and fill (...)
WL18XX-CERTIFICATION — Are you looking for WiLink™ 8 module certification support? WL18XX-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Features
- The WL18XX-REPORTS link provides access to WiLinik™ 8 certification reports for:
- WL18XX modules
- WL18XX Evaluation boards (note: reports for evaluation boards are for reference only)
- The WL18XX-REQUEST link provides:
- A TI letter of authorization for FCC and ISED when requested by the customer's regulatory (...)
Reference designs
TIDA-050034 — TIDA-050034 is a fully functional development board combining a TI PMIC, TPS65218DO, with NXP i.MX 7Dual Application Processor.
The hardware design consists of DDR3L SDRAM (2x512MB), 64MB Serial NOR Flash, 8GB eMMC 5.0 iNAND, SD Card interface v3.0, 50 pin LCD Connector for external TFT display (...)
Design files
-
download TIDA-050034 BOM.pdf (515KB) -
download TIDA-050034 Assembly Files.zip (547KB) -
download TIDA-050034 Layer Plots.zip (540KB) -
download TIDA-050034 CAD Files.zip (8958KB) -
download TIDA-050034 Gerber.zip (2330KB)
TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE — The TI WiLink™ 8 WL1837MOD ( https://www.ti.com/product/wl1837mod ) audio cape is wireless multi-room audio reference design used with BeagleBone Black (https://www.ti.com/tool/beaglebk featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise (...)
Design files
-
download WiLink 8 Wi-Fi Bluetooth Smart Audio Multiroom Cape BOM.pdf (94KB) -
download WiLink 8 Wi-Fi Bluetooth Smart Audio Multiroom Cape Assembly Drawing.pdf (229KB) -
download WiLink 8 Wi-Fi Bluetooth Smart Audio Multiroom Cape PCB.pdf (2773KB) -
download WiLink 8 Wi-Fi Bluetooth Smart Audio Multiroom Cape CAD Files.zip (385KB) -
download WiLink 8 Wi-Fi Bluetooth Smart Audio Multiroom Cape Gerber.zip (395KB)
TIDC-WL1835MODCOM8B — The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
Design files
-
download 2.4 GHz WiFi+Bluetooth Certified Antenna Design on WiLink 1835 Module BOM.pdf (222KB) -
download 2.4 GHz WiFi+Bluetooth Certified Antenna Design on WiLink 1835 Module Gerber.zip (134KB) -
download 2.4 GHz WiFi+Bluetooth Certified Antenna Design on WiLink 1835 Module Layer Plot.zip (380KB) -
download 2.4 GHz WiFi+BT Certified Antenna Design on WiLink 1835 Module PCB .asc Layout.zip (288KB) -
download 2.4 GHz WiFi+Bluetooth Certified Antenna Design on WiLink 1835 Module CAD Files (Rev. A).zip (49KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| QFM (MOC) | 100 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.