Product details

Processor External MPU Package (mm) MOC (100 pin LGA Module) Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (Max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, STA, Wi-Fi direct mode, Mesh over Wi-Fi based on 802.11s, Bluetooth, Bluetooth low energy, COEX
Processor External MPU Package (mm) MOC (100 pin LGA Module) Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (Max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, STA, Wi-Fi direct mode, Mesh over Wi-Fi based on 802.11s, Bluetooth, Bluetooth low energy, COEX
QFM (MOC) 100 178 mm² 13.4 x 13.3
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –20°C to +70°C
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy (WL183xMOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –20°C to +70°C
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy (WL183xMOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

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Technical documentation

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Type Title Date
* Data sheet WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (LE) datasheet (Rev. N) 26 Apr 2021
* Radiation & reliability report WL1831MOD Reliability Data - Reliability Estimate 27 Jul 2017
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. A) 14 Jun 2021
Selection guide 無線連線技術選擇指南 (Rev. A) 14 Jun 2021
Selection guide 무선 연결 기술 선택 가이드 (Rev. A) 14 Jun 2021
Selection guide Wireless Connectivity Technology Selection Guide (Rev. A) 27 May 2021
User guide WiLink8 Getting Started Guide (Rev. A) 14 May 2021
Certificate WL18MODGB (Test Grade 31: WL1831MODGBMOC) EC DoC (Rev. A) 03 Mar 2021
White paper WiLink8 Use Case Guide 30 Dec 2020
User guide WiLink8 Driver Debug 07 Dec 2020
User guide WiLink8 Linux Advanced Demos 07 Dec 2020
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) 27 Oct 2020
Application note Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) 18 May 2020
Application note Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V 18 May 2020
More literature Sitara™ processors + WiLink™ 8 Wi-Fi® + Bluetooth® combo connectivity (Rev. A) 30 Jul 2019
User guide WL18xx Module Hardware Integration Guide (Rev. B) 09 Jul 2019
Design guide WL18xx Design Checklist 27 Jun 2019
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 Jan 2019
Technical article An out-of-the-box Internet of Things: building a seamless and secure smart home network 12 Jun 2018
Technical article Thread vs. Zigbee – what’s the difference? 16 May 2018
Technical article Your microcontroller deserves a nap – designing “sleepy” wireless applications 28 Mar 2018
User guide WiLink™ 8.0 Bluetooth® Vendor-Specific HCI Commands (Rev. B) 17 Oct 2017
Application note Secure Connection Capability for WiLink Bluetooth 4.2 19 May 2017
Technical article SimpleLink™ MCU SDKs: Breaking down TI Drivers 12 Apr 2017
More literature Streamline the challenges of RF design with certified wireless modules 25 Jan 2017
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans MCP 28 Dec 2016
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans NLCP 28 Dec 2016
Application note WiLink 8.0TM WLAN IP Mesh Application Report 01 Jun 2016
User guide WiLinkT™ 8 WLAN Features User's Guide (Rev. A) 26 May 2016
White paper Wi-Fi® mesh networks: Discover new wireless paths 24 May 2016
White paper Streaming Audio: Follow the signal chain white paper 14 Apr 2016
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans 15 Feb 2016
More literature WiLink 8 Wi-Fi + Bluetooth/BLE Modules (Rev. B) 03 Feb 2016
Application note Precise Time Synchronization Over WLAN (Rev. A) 18 Dec 2015
Application note WL18xx .INI File (Rev. A) 03 Dec 2015
White paper Wi-Fi® audio: capabilities and challenges 02 Dec 2015
User guide WL1835MODCOM8 WLAN MIMO/BT Module Board (Rev. E) 29 Sep 2015
Application note Enhanced HCILL: Four-Wire Power Management Protocol (Rev. B) 24 Sep 2015
Application note WL18xx Level-shifting I/O (Rev. A) 19 Aug 2015
Application note WiLink 8 Solutions WiLink8 - wlconf Manual 01 Jul 2015
White paper Complete solutions for next-generation wireless connected audio 02 Jan 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMDSEVM437X — AM437x high security evaluation module

TMDXEVM437XH is a high security evaluation module (EVM) that enables developers to evaluate secure boot functionality, including signing and encryption on high security AM437x devices.

This is a socketed EVM that includes an AM437x high security device and TI development key for evaluating secure (...)

In stock
Limit: 5
Evaluation board

TMDSEVM572X — AM572x evaluation module

The AM572x evaluation module provides an affordable platform to quickly start evaluation of Sitara™ Arm® Cortex®-A15 AM57x processors (AM5728AM5726AM5718AM5716) and accelerate development for HMI, machine vision, networking, medical imaging and many other industrial applications. It is a (...)

In stock
Limit: 5
Evaluation board

TMDXEVM3358 — AM335x evaluation module

The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications for factory automation, building automation, grid infrastructure, and more.

In stock
Limit: 1
Evaluation board

WL18XXCOM82SDMMC — WL18XXCOM82SDMMC

The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)

In stock
Limit: 50
Daughter card

WL1835MODCOM8B — WiLink™ 8 Module 2.4 GHz WiFi® + Bluetooth® COM8 Evaluation Module

TI WiLink™ 8 module family

The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.

The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)

Out of stock on TI.com
Daughter card

WL1837MODCOM8I — WiLink™ 8 Dual Band 2.4 & 5 GHz Wi-Fi® + Bluetooth® COM8 Evaluation Module

TI WiLink™ 8 module family The WL1837MODCOM8I is one of the two evaluation boards for the TI WiLink™ 8 combo module family. For designs requiring performance in the 2.4 GHz band only, see the WL1835MODCOM8.

The WL1837MODCOM8I, which is compatible with many processors including TI’s (...)

In stock
Limit: 50
Software development kit (SDK)

PROCESSOR-SDK-AM335X — Processor SDK for AM335x Sitara Processors - Linux and TI-RTOS support

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
Application software & framework

WILINK-BT_WIFI-WIRELESS_TOOLS — WiLink™ Wireless Tools for WL18XX modules

This package includes the following applications:
  • WLAN Real-Time Tuning Tool (RTTT)
  • Bluetooth® Logger
  • WLAN gLogger
  • Link Quality Monitor (LQM)
  • HCITester Tool
    • BTSout
    • BTSTransform
    • ScriptPad

The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)

Application software & framework

WILINK-WIFI_MESH_VISUALIZATION_TOOL — WiLink™ Mesh Visualization Tool for WL18XX Modules

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Driver or library

TI-BT-4-2-STACK-LINUX-ADDON — TI Bluetooth 4.2 Stack Add-On for Linux Platforms With WL183x and CC2564C

This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
Driver or library

TI-BT-STACK-LINUX-ADDON — TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and CC256x

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Driver or library

WILINK8-WIFI-MCP8 — WiLink™ 8 Proprietary Wi-Fi Driver – QNX, WinCE, Nucleus RTOS baseline

The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)

Driver or library

WILINK8-WIFI-NLCP — WiLink™ 8 Wi-Fi Driver for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

Driver or library

WL18XX-BT-SP — Bluetooth service pack for WL18xx

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not updated per (...)

Design tool

WILINK-DESIGN-REVIEWS — Hardware design reviews for WL18xx devices

To get started with the WiLink™ hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see WL18xx product page links below).
  • Step 2: Download and (...)
Certification

WL18XX-CERTIFICATION — Radio certification for WiLink™ 8

Are you looking for WiLink™ 8 module certification support? WL18XX-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Reference designs

TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE — TI WiLink™8 Wi-Fi®/Bluetooth®/Bluetooth Low Energy audio multi-room cape reference design

The TI WiLink™ 8 WL1837MOD audio cape is a wireless multi-room audio reference design used with BeagleBone Black (featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP's beacon is used to achieve ultra-precise (...)
Reference designs

TIDA-050034 — Integrated power supply reference design for NXP i.MX 7D processor

TIDA-050034 is a fully functional development board combining a TI PMIC, TPS65218DO, with NXP i.MX 7Dual Application Processor.

The hardware design consists of DDR3L SDRAM (2x512MB), 64MB Serial NOR Flash, 8GB eMMC 5.0 iNAND, SD Card interface v3.0, 50 pin LCD Connector for external TFT display (...)

Reference designs

TIDC-WL1835MODCOM8B — 2.4 GHz WiFi® + Bluetooth® Certified Antenna Design on WiLink™ 1835 Module

The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
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QFM (MOC) 100 View options

Ordering & quality

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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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