DLPS229 December   2022 DLP4621-Q1

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
      1. 6.4.1 Illumination Overfill Diagram
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
      1.      Electrical and Timing Diagrams
    8. 6.8  Switching Characteristics
      1. 6.8.1 LPSDR and Test Load Circuit Diagrams
    9. 6.9  System Mounting Interface Loads
      1.      System Interface Loads Diagram
    10. 6.10 Physical Characteristics of the Micromirror Array
      1. 6.10.1 Array Physical Characteristics Diagram
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 SubLVDS Data Interface
      2. 7.3.2 Low Speed Interface for Control
      3. 7.3.3 DMD Voltage Supplies
      4. 7.3.4 Asynchronous Reset
      5. 7.3.5 Temperature Sensing Diode
        1. 7.3.5.1 Temperature Sense Diode Theory
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Monitoring Array Temperature Using the Temperature Sense Diode
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application Overview
      2. 8.2.2 Reference Design
      3. 8.2.3 Application Mission Profile Consideration
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 DMD Handling
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • FQX|120
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for automotive applications
    • –40°C to 105°C operating DMD array temperature range
  • The DLP4621-Q1 automotive chipset includes:
    • DLP4621-Q1 DMD
    • DLPC230-Q1 DMD controller
    • TPS99001-Q1 system management and illumination controller
  • 0.46-inch diagonal micromirror array
    • 7.6-μm micromirror pitch
    • ±12° micromirror tilt angle (relative to flat state)
    • Bottom illumination enables high efficiency and smaller engine size
    • 0.9-megapixel array (960 × 960, 2:1) enabling high resolution and wide aspect ratio automotive applications
    • Compatible with LED or laser illumination
  • 600-MHz subLVDS DMD interface for low power and emission
  • 10-kHz DMD refresh rate over temperature extremes
  • Built-in self test (BIST) of DMD memory cells