JAJSH89D May   2012  – April 2019 CDCUN1208LP

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     ピン構成の概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Digital Input Electrical Characteristics – OE (SCL), INSEL, ITTP, OTTP, Divide (SDA/MOSI), ERC(ADDR/CS), Mode
    6. 6.6  Universal Input (IN1, IN2) Characteristics
    7. 6.7  Clock Output Buffer Characteristics (Output Mode = LVDS)
    8. 6.8  Clock Output Buffer Characteristics (Output Mode = HCSL)
    9. 6.9  Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS)
    10. 6.10 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    11. 6.11 Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Configurations
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Device Control Using Configuration Pins
        1. 8.3.1.1 Configuration of Output Type (OTTP)
        2. 8.3.1.2 Configuration of Edge Rate Control (ERC)
        3. 8.3.1.3 Control of Output Enable (OE)
      2. 8.3.2 Input Ports (IN1, IN2)
        1. 8.3.2.1 Configuration of the Input Type (ITTP)
        2. 8.3.2.2 Configuration of the IN2 Divider (INDIV)
      3. 8.3.3 Smart Input Multiplexer (INMUX)
        1. 8.3.3.1 Pin Configuration of the Smart Input Multiplexer (INMUX)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Control Using the Host Interface
        1. 8.4.1.1 OE and INSEL in Host Configuration Mode
    5. 8.5 Programming
      1. 8.5.1 Host Interface Hardware Information
        1. 8.5.1.1 SPI Communication
          1. 8.5.1.1.1 CDCUN1208LP SPI Addressing
          2. 8.5.1.1.2 Writing to the CDCUN1208LP
          3. 8.5.1.1.3 Reading From the CDCUN1208LP
          4. 8.5.1.1.4 Block Write/Read Operation
        2. 8.5.1.2 I2C Communication
          1. 8.5.1.2.1 Message Transmission
            1. 8.5.1.2.1.1 Data and Address Bits
            2. 8.5.1.2.1.2 Special Symbols – Start (S) and Stop (P)
            3. 8.5.1.2.1.3 Special Symbols – Acknowledge (ACK)
            4. 8.5.1.2.1.4 Generic Message Frame
            5. 8.5.1.2.1.5 CDCUN1208LP Message Format
            6. 8.5.1.2.1.6 CDCUN1208LP Device Addressing (I2C Address)
            7. 8.5.1.2.1.7 CDCUN1208LP Device Addressing (Register Address)
          2. 8.5.1.2.2 I2C Master and Slave Handshaking
          3. 8.5.1.2.3 Block Read/Write
          4. 8.5.1.2.4 I2C Timing
    6. 8.6 Register Maps
      1. 8.6.1 Device Registers
        1. 8.6.1.1 Device Registers: Register 00-07
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 PCI Express Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
    3. 9.3 Systems Examples
  10. 10Power Supply Recommendations
    1. 10.1 CDCUN1208LP Power Consumption
    2. 10.2 Device Power Supply Connections and Sequencing
    3. 10.3 Device Inputs (IN1, IN2)
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 CDCUN1208LP Power Consumption

Table 14. CDCUN1208LP Power Consumption (TA = –40°C to 85°C)

PARAMETER DEVICE SETTINGS (See Table 1)(1) TEST
CONFIGURATION		 DESCRIPTION MAX CURRENT
VDD= 1.8V
fOUT = fin = 100 MHz		 MAX CURRENT
VDD = 3.3V
fOUT = fin = 100MHz		 UNIT
MODE OE ERC OTTP INSEL ITTP PD Bit
IPD1.8,3.3 L or H L X X X L H Host configuration mode
(see Host Configuration Mode) 		Device power down 3 4 mA
ICORE1.8,3.3 O L X X X L X Figure 25a,b,c Device outputs off 26 35 mA
IHCSL1.8,3.3 O H O H L O X Figure 25a HCSL buffer current consumption(2) 23 23 mA
ILVDS1.8,3.3 O H O L L O X Figure 25b LVDS buffer current consumption(2) 9 9 mA
ILVCMOS1.8,3.3 O H O O L O X Figure 25c LVCMOS buffer current consumption (one side)(2) 8 11 mA
IDEV-HCSL1.8,3.3 O H O H L O X Figure 25a Device current consumption – HCSL mode 200 200 mA
IDEV-LVDS1.8,3.3 O H O L L O X Figure 25b Device current consumption – LVDS mode 80 90 mA
IDEV-LVCMOS1.8,3.3 O H O O L O X Figure 25c Device current consumption – LVCMOS mode 130 210 mA
(1) H = input high, L = input low; O = input open
(2) Buffer current consumption values represent the average of the current drawn by VDDO1, VDDO2, VDDO3, and VDDO4, divided by 8 (differential mode) or 16 (single-ended mode).