JAJSLA9E may   2015  – april 2023 DLP7000UV

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. 概要 (続き)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  LVDS Timing Requirements
    8. 7.8  LVDS Waveform Requirements
    9. 7.9  Serial Control Bus Timing Requirements
    10. 7.10 Systems Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Window Characteristics
    14. 7.14 Chipset Component Usage Specification
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 8.3.2 DLPA200 DMD Micromirror Driver
      3. 8.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 8.3.4 DLP7000 - DLP 0.7 XGA 2xLVDS UV Type-A DMD
        1. 8.3.4.1 DLP7000UV Chipset Interfaces
          1. 8.3.4.1.1 DLPC410 Interface Description
            1. 8.3.4.1.1.1 DLPC410 IO
            2. 8.3.4.1.1.2 Initialization
            3. 8.3.4.1.1.3 DMD Device Detection
            4. 8.3.4.1.1.4 Power Down
        2. 8.3.4.2 DLPC410 to DMD Interface
          1. 8.3.4.2.1 DLPC410 to DMD IO Description
          2. 8.3.4.2.2 Data Flow
        3. 8.3.4.3 DLPC410 to DLPA200 Interface
          1. 8.3.4.3.1 DLPA200 Operation
          2. 8.3.4.3.2 DLPC410 to DLPA200 IO Description
        4. 8.3.4.4 DLPA200 to DLP7000UV Interface Overview
      5. 8.3.5 Measurement Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 DMD Operation
        1. 8.4.1.1 Single Block Mode
        2. 8.4.1.2 Dual Block Mode
        3. 8.4.1.3 Quad Block Mode
        4. 8.4.1.4 Global Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation
    7. 8.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DMD Reflectivity Characteristics
      2. 9.1.2 Design Considerations Influencing DMD Reflectivity
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Sequence (Handled by the DLPC410)
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLP7000UV Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Overview

Optically, the DLP7000UV consists of 786432 highly reflective, digitally switchable, micrometer-sized mirrors (micromirrors), organized in a two-dimensional array of 1024 micromirror columns by 768 micromirror rows (Figure 8-5). Each aluminum micromirror is approximately 13.68 microns in size (see the Micromirror Pitch in Figure 8-5), and is switchable between two discrete angular positions: –12° and +12°. The angular positions are measured relative to a 0° flat state, which is parallel to the array plane (see Figure 8-6). The tilt direction is perpendicular to the hinge-axis which is positioned diagonally relative to the overall array. The On State landed position is directed towards Row 0, Column 0 (upper left) corner of the device package (see the Micromirror Hinge-Axis Orientation in Figure 8-5). In the field of visual displays, the 1024 by 768 pixel resolution is referred to as XGA.

Each individual micromirror is positioned over a corresponding CMOS memory cell. The angular position of a specific micromirror is determined by the binary state (logic 0 or 1) of the corresponding CMOS memory cell contents, after the micromirror clocking pulse is applied. The angular position (–12° or +12°) of the individual micromirrors changes synchronously with a micromirror clocking pulse, rather than being synchronous with the CMOS memory cell data update. Therefore, writing a logic 1 into a memory cell followed by a micromirror clocking pulse will result in the corresponding micromirror switching to a +12° position. Writing a logic 0 into a memory cell followed by a micromirror clocking pulse will result in the corresponding micromirror switching to a –12° position.

Updating the angular position of the micromirror array consists of two steps. First, updating the contents of the CMOS memory. Second, application of a Micromirror Clocking Pulse to all or a portion of the micromirror array (depending upon the configuration of the system). Micromirror Clocking Pulses are generated externally by a DLPA200, with application of the pulses being coordinated by the DLPC410 controller.

Around the perimeter of the 1024 by 768 array of micromirrors is a uniform band of active border micromirrors. The pond of micromirror (POM) is not user-addressable. The border micromirrors land in the –12° position once power has been applied to the device. There are 10 border micromirrors on each side of the 1024 by 768 active array.

Figure 8-1 shows a DLPC410 and DLP7000UV Chipset Block Diagram. The DLPC410 and DLPA200 control and coordinate the data loading and micromirror switching for reliable DLP7000UV operation. The DLPR410 is the programmed PROM required to properly configure the DLPC410 controller. For more information on the chipset components, see Application and Implementation. For a typical system application using the DLP Discovery 4100 chipset including the DLP7000UV, see Figure 9-2.