JAJSU28 March   2023 DRV8329-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specification
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Auto
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information 2pkg
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Three BLDC Gate Drivers
        1. 7.3.1.1 PWM Control Modes
          1. 7.3.1.1.1 6x PWM Mode
          2. 7.3.1.1.2 3x PWM Mode
        2. 7.3.1.2 Device Hardware Interface
        3. 7.3.1.3 Gate Drive Architecture
          1. 7.3.1.3.1 Propagation Delay
          2. 7.3.1.3.2 Deadtime and Cross-Conduction Prevention
      2. 7.3.2 AVDD Linear Voltage Regulator
      3. 7.3.3 Pin Diagrams
      4. 7.3.4 Low-Side Current Sense Amplifiers
        1. 7.3.4.1 Current Sense Operation
      5. 7.3.5 Gate Driver Shutdown Sequence (DRVOFF)
      6. 7.3.6 Gate Driver Protective Circuits
        1. 7.3.6.1 PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 7.3.6.2 AVDD Power on Reset (AVDD_POR)
        3. 7.3.6.3 GVDD Undervoltage Lockout (GVDD_UV)
        4. 7.3.6.4 BST Undervoltage Lockout (BST_UV)
        5. 7.3.6.5 MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 7.3.6.6 VSENSE Overcurrent Protection (SEN_OCP)
        7. 7.3.6.7 Thermal Shutdown (OTSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Gate Driver Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Operating Mode
        3. 7.4.1.3 Fault Reset (nSLEEP Reset Pulse)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Three Phase Brushless-DC Motor Control
        1. 8.2.1.1 Detailed Design Procedure
          1. 8.2.1.1.1  Motor Voltage
          2. 8.2.1.1.2  Bootstrap Capacitor and GVDD Capacitor Selection
          3. 8.2.1.1.3  Gate Drive Current
          4. 8.2.1.1.4  Gate Resistor Selection
          5. 8.2.1.1.5  System Considerations in High Power Designs
            1. 8.2.1.1.5.1 Capacitor Voltage Ratings
            2. 8.2.1.1.5.2 External Power Stage Components
            3. 8.2.1.1.5.3 Parallel MOSFET Configuration
          6. 8.2.1.1.6  Dead Time Resistor Selection
          7. 8.2.1.1.7  VDSLVL Selection
          8. 8.2.1.1.8  AVDD Power Losses
          9. 8.2.1.1.9  Current Sensing and Output Filtering
          10. 8.2.1.1.10 Power Dissipation and Junction Temperature Losses
      2. 8.2.2 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Bulk Capacitance Sizing
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Thermal Considerations
        1. 8.4.2.1 Power Dissipation
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Related Links
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 Community Resources
    6. 9.6 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most-current data available for the designated device. This data is subject to change without notice and without revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.

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