SNOSCZ7B December   2015  – April 2024 LDC0851

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Interface Voltage Levels
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic Operation Mode
      2. 6.3.2 Threshold Adjust Mode
      3. 6.3.3 Setting the Threshold Adjust Values
      4. 6.3.4 Hysteresis
      5. 6.3.5 Conversion Time
      6. 6.3.6 Power-Up Conditions
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Sensor Design
        1. 7.1.1.1 Sensor Frequency
        2. 7.1.1.2 Sensor Design Procedure
    2. 7.2 Typical Application
      1. 7.2.1 Event Counting
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Coarse Position Sensing
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 Low Power Operation
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Side by Side Coils
        2. 7.4.2.2 Stacked Coils
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1)LDC0851UNIT
DSG (WSON)
8 PINS
RθJAJunction-to-ambient thermal resistance67.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance89.3°C/W
RθJBJunction-to-board thermal resistance37.3°C/W
ψJTJunction-to-top characterization parameter2.4°C/W
ψJBJunction-to-board characterization parameter37.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).