JAJSCV4 December   2016 LM73-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics- Digital DC Characteristics
    7. 6.7 SMBus Digital Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-On Reset
      2. 7.3.2 One-Shot Conversion
      3. 7.3.3 Temperature Data Format
      4. 7.3.4 SMBus Interface
      5. 7.3.5 ALERT Function
      6. 7.3.6 Communicating With the LM73-Q1
        1. 7.3.6.1 Reading from the LM73-Q1
        2. 7.3.6.2 Writing to the LM73-Q1
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
    5. 7.5 Register Map
      1. 7.5.1 LM73-Q1 Registers
        1. 7.5.1.1 Pointer Register
        2. 7.5.1.2 Temperature Data Register
        3. 7.5.1.3 Configuration Register
        4. 7.5.1.4 THIGH Upper-Limit Register
        5. 7.5.1.5 TLOW Lower-Limit Register
        6. 7.5.1.6 Control/Status Register
        7. 7.5.1.7 Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Thermal Path Considerations
      2. 8.1.2 Output Considerations: Tight Accuracy, Resolution and Low Noise
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Layout

10.1 Layout Guidelines

To achieve the expected results when measuring temperature with an integrated circuit temperature sensor like the LM73-Q1, it is important to understand that the sensor measures its own die temperature. For the LM73-Q1, the best thermal path between the die and the outside world is through the LM73-Q1's pins. In the SOT-23 package, all the pins on the LM73-Q1 will have an equal effect on the die temperature. Because the pins represent a good thermal path to the LM73-Q1 die, the LM73-Q1 will provide an accurate measurement of the temperature of the printed circuit board on which it is mounted.

10.2 Layout Example

LM73-Q1 LM73.gif Figure 15. PBC Layout