JAJSCV4 December 2016 LM73-Q1
PRODUCTION DATA.
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
Supply Voltage | −0.3 | V to 6 | V | ||
Voltage at SMBCLK and SMBDAT pins | −0.3 V to V | 6 | V | ||
Voltage at All Other Pins | −0.3 | (VDD + 0.5) | 6 | V | |
Input Current at Any Pin(1) | ±5 | mA | |||
Storage Temperature, Tstg | −65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | ±1000 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
LM73-Q1 | –40 | 125 | °C | |
Supply Voltage Range (VDD) | 2.7 | 5.5 | V |
THERMAL METRIC(1) | LM73-Q1 | UNIT | |
---|---|---|---|
DDC (SOT) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 117 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 55 | |
RθJA | Junction-to-board thermal resistance | 25 | |
ψJT | Junction-to-top characterization parameter | 1 | |
ψJB | Junction-to-board characterization parameter | 21 |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
Accuracy (2) | VDD = 3.3V | TA = −40°C to -25°C | –1.85 | 1.85 | °C | ||
TA = −25°C to –10°C | –1.65 | 1.65 | °C | ||||
TA = −10°C to 80°C | –1.45 | 1.45 | °C | ||||
TA = 80°C to 115°C | –1.65 | 1.65 | °C | ||||
TA = 115°C to 125°C | -1.8 | 1.8 | °C | ||||
VDD = 2.7V to VDD = 4.5V |
TA = −40°C to -25°C | -2.1 | 2.1 | °C | |||
TA = −25°C to –10°C | –1.75 | 1.75 | °C | ||||
TA = −10°C to 80°C | -1.65 | 1.65 | °C | ||||
TA = 80°C to 115°C | -1.8 | 1.8 | °C | ||||
TA = 115°C to 125°C | -2 | 2 | °C | ||||
VDD > 4.5V to VDD = 5.5V |
TA = −40°C to -25°C | -2.4 | 2.4 | °C | |||
TA = −25°C to -10°C | -2.2 | 2.2 | °C | ||||
TA = −10°C to 80°C | –1.9 | 1.9 | °C | ||||
TA = 80°C to 115°C | -1.8 | 1.8 | °C | ||||
TA = 115°C to 125°C | -2 | 2 | °C | ||||
Resolution | RES1 Bit = 0, RES0 Bit = 0 | 11 | Bits | ||||
0.25 | °C/LSB | ||||||
RES1 Bit = 0, RES0 Bit = 1 | 12 | Bits | |||||
0.125 | °C/LSB | ||||||
RES1 Bit = 1, RES0 Bit = 0 | 13 | Bits | |||||
0.0625 | °C/LSB | ||||||
RES1 Bit = 1, RES0 Bit = 1 | 14 | Bits | |||||
0.03125 | °C/LSB | ||||||
Temperature Conversion Time (3) | RES1 Bit = 0, RES0 Bit = 0 | 10.1 | ms | ||||
TA = TJ =TMIN to TMAX | 14 | ||||||
RES1 Bit = 0, RES0 Bit = 1 | 20.2 | ms | |||||
TA = TJ =TMIN to TMAX | 28 | ||||||
RES1 Bit = 1, RES0 Bit = 0 | 40.4 | ms | |||||
TA = TJ =TMIN to TMAX | 56 | ||||||
RES1 Bit = 1, RES0 Bit = 1 | 80.8 | ms | |||||
TA = TJ =TMIN to TMAX | 112 | ||||||
Quiescent Current | Continuous Conversion Mode, SMBus inactive | 320 | µA | ||||
TA = TJ =TMIN to TMAX | 495 | ||||||
Shutdown, bus-idle timers on | 120 | µA | |||||
TA = TJ =TMIN to TMAX | 175 | ||||||
Shutdown, bus-idle timers off | 1.9 | µA | |||||
TA = TJ =TMIN to TMAX | 8 | ||||||
Power-On Reset Threshold | Measured on VDD input, falling edge | TA = TJ =TMIN to TMAX | 0.9 | V |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
SMBDAT, SMBCLK INPUTS | |||||||
VIH | Logical 1 Input Voltage | TA = TJ =TMIN to TMAX | 0.7 × VDD | V | |||
VIL | Logical 0 Input Voltage | TA = TJ =TMIN to TMAX | 0.3 × VDD | V | |||
VIN;HYST | SMBDAT and SMBCLK Digital Input Hysteresis | 0.07 × VDD | V | ||||
IIH | Logical 1 Input Current | VIN = VDD | 0.01 | µA | |||
TA = TJ =TMIN to TMAX | 2 | ||||||
IIL | Logical 0 Input Current | VIN = 0 V | –0.01 | µA | |||
TA = TJ =TMIN to TMAX | –2 | ||||||
CIN | Input Capacitance | 5 | pF | ||||
SMBDAT, ALERT OUTPUTS | |||||||
IOH | High Level Output Current | VOH = VDD | 0.01 | µA | |||
TA = TJ =TMIN to TMAX | 2 | ||||||
VOL | SMBus Low Level Output Voltage | IOL = 3 mA | TA = TJ =TMIN to TMAX | 0.4 | V | ||
ADDRESS INPUT | |||||||
VIH;ADDRESS | Address Pin High Input Voltage | TA = TJ =TMIN to TMAX | VDD – 0.100 | V | |||
VIL;ADDRESS | Address Pin Low Input Voltage | TA = TJ =TMIN to TMAX | 0.100 | V | |||
IIH; ADDRESS | Address Pin High Input Current | VIN = VDD | 0.01 | µA | |||
TA = TJ =TMIN to TMAX | 2 | ||||||
IIL;ADDRESS | Address Pin Low Input Current | VIN = 0 V | –0.01 | µA | |||
TA = TJ =TMIN to TMAX | –2 |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
fSMB | SMBus Clock Frequency | No minimum clock frequency if Time-Out feature is disabled. | TA = TJ =TMIN to TMAX | 400 | kHz | ||
tLOW | SMBus Clock Low Time | TA = TJ =TMIN to TMAX | 300 | ns | |||
tHIGH | SMBus Clock High Time | TA = TJ =TMIN to TMAX | 300 | ns | |||
tF;SMBO | Output Fall Time (4) | CL = 400 pF IPULL-UP ≤ 3 mA |
TA = TJ =TMIN to TMAX | 250 | ns | ||
tTIMEOUT | SMBDAT and SMBCLK Time Low for Reset of Serial Interface (5) | TA = TJ =TMIN to TMAX | 15 | 45 | ms | ||
tSU;DAT | Data In Setup Time to SMBCLK High | TA = TJ =TMIN to TMAX | 100 | ns | |||
tHD;DATI | Data Hold Time: Data In Stable after SMBCLK Low | TA = TJ =TMIN to TMAX | 0 | ns | |||
tHD;DATO | Data Hold Time: Data Out Stable after SMBCLK Low | TA = TJ =TMIN to TMAX | 30 | ns | |||
tHD;STA | Start Condition SMBDAT Low to SMBCLK Low (Start condition hold before the first clock falling edge) | TA = TJ =TMIN to TMAX | 60 | ns | |||
tSU;STO | Stop Condition SMBCLK High to SMBDAT Low (Stop Condition Setup) | TA = TJ =TMIN to TMAX | 50 | ns | |||
tSU;STA | SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBDAT Low | TA = TJ =TMIN to TMAX | 50 | ns | |||
tBUF | SMBus Free Time Between Stop and Start Conditions | TA = TJ =TMIN to TMAX | 1.2 | µs | |||
tPOR | Power-On Reset Time (6) | TA = TJ =TMIN to TMAX | 1 | ms |