JAJSE59 October   2017 LMT87-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      熱時定数
      2.      出力電圧と温度との関係
  4. 改訂履歴
  5. Device Comparison Tables
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Accuracy Characteristics
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LMT87-Q1 Transfer Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Mounting and Thermal Conductivity
      2. 8.4.2 Output Noise Considerations
      3. 8.4.3 Capacitive Loads
      4. 8.4.4 Output Voltage Shift
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Connection to ADC
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Conserving Power Dissipation With Shutdown
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Mounting and Thermal Conductivity

The LMT87-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface.

To ensure good thermal conductivity, the backside of the LMT87-Q1 die is directly attached to the GND pin. The temperatures of the lands and traces to the other leads of the LMT87-Q1 will also affect the temperature reading.

Alternatively, the LMT87-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT87-Q1 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. If moisture creates a short circuit from the output to ground or VDD, the output from the LMT87-Q1 will not be correct. Printed-circuit coatings are often used to ensure that moisture cannot corrode the leads or circuit traces.

The thermal resistance junction to ambient (RθJA or θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. Use Equation 7 to calculate the rise in the LMT87-Q1 die temperature:

Equation 7. LMT87-Q1 equation_5_nis170.gif

where

  • TA is the ambient temperature,
  • IS is the supply current,
  • ILis the load current on the output,
  • and VO is the output voltage.

For example, in an application where TA = 30°C, VDD = 5 V, IS = 5.4 μA, VOUT = 2231 mV, and IL = 2 μA, the junction temperature would be 30.014°C, showing a self-heating error of only 0.014°C. Because the junction temperature of the LMT87-Q1 is the actual temperature being measured, take care to minimize the load current that the LMT87-Q1 is required to drive. shows the thermal resistance of the LMT87-Q1.