JAJSQD9B january   2015  – june 2023 LV2862

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Continuous Conduction Mode
      2. 7.3.2 Fixed Frequency PWM Control
      3. 7.3.3 Eco-mode
      4. 7.3.4 Bootstrap Voltage (CB)
      5. 7.3.5 Enable (SHDN) and VIN Undervoltage Lockout (UVLO)
      6. 7.3.6 Setting the Output Voltage
      7. 7.3.7 Current Limit
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Design Guide – Step By Step Design Procedure
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the Switching Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Schottky Diode Selection
        5. 8.2.2.5 Input Capacitor Selection
          1. 8.2.2.5.1 Bootstrap Capacitor Selection
            1. 8.2.2.5.1.1 Typical Application Circuits
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

Layout is a critical portion of good power supply design. The following guidelines helps users design a PCB with the best power conversion performance, thermal performance, and minimized generation of unwanted EMI.

  1. The feedback network, resistors R1 and R2, must be kept close to the FB pin and away from the inductor to minimize coupling noise into the feedback pin.
  2. The input capacitor CIN must be placed close to the VIN pin. This reduces copper trace inductance which affects input voltage ripple of the IC.
  3. The inductor L1 must be placed close to the SW pin to reduce magnetic and electrostatic noise.
  4. The output capacitor COUT must be placed close to the junction of L1 and the diode D1. The L1, D1, and COUT trace must be as short as possible to reduce conducted and radiated noise.
  5. The ground connection for the diode, CIN and COUT must be tied to the system ground plane in only one spot (preferably at the COUT ground point) to minimize conducted noise in the system ground plane.
  6. For more detail on switching power supply layout considerations, see Application Note AN-1149, Layout Guidelines for Switching Power Supplies.