JAJSGP3A December   2018  – December 2019 OPA462

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      OPA462 ブロック図
      2.      最大出力電圧と周波数との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: Table of Graphs
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Status Flag Pin
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Current Limit
      4. 7.3.4 Enable and Disable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High DAC Gain Stage for Semiconductor Test Equipment
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Improved Howland Current Pump for Bioimpedance Measurements in Multiparameter Patient Monitors
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermally-Enhanced PowerPAD Package
      2. 10.1.2 PowerPAD Integrated Circuit Package Layout Guidelines
      3. 10.1.3 Pin Leakage
      4. 10.1.4 Thermal Protection
      5. 10.1.5 Power Dissipation
      6. 10.1.6 Heat Dissipation
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 開発サポート
        1. 11.1.1.1 TINA-TI™ (無料のダウンロード・ソフトウェア)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH Filter Designer
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 サポート・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1.1 Thermally-Enhanced PowerPAD™ Package

The OPA462 comes in an 8-pin SO PowerPAD package that provides an extremely low thermal resistance, RθJC(bot), path between the die and the exterior of the package. This package features an exposed thermal pad that has direct thermal contact with the die. Thus, excellent thermal performance is achieved by providing a good thermal path away from the thermal pad.

The OPA462 SO-8 PowerPAD is a standard-size SO-8 package constructed using a downset leadframe upon which the die is mounted, as Figure 67 shows. This arrangement results in the leadframe being exposed as a thermal pad on the underside of the package. The thermal pad on the bottom of the device can then be soldered directly to the PCB, using the PCB as a heat sink. In addition, plated-through holes (vias) provide a low thermal resistance heat flow path to the back side of the PCB. This architecture enhances the OPA462 power dissipation capability significantly, eliminates the use of bulky heat sinks and slugs traditionally used in thermal packages, and allows the OPA462 to be easily mounted using standard PCB assembly techniques.

NOTE

The SO-8 PowerPAD is pin-compatible with standard SO-8 packages, and as such, the OPA462 is a drop-in replacement for operational amplifiers in existing sockets. Always solder the PowerPAD to the PCB V– plane, even with applications that have low power dissipation. Solder the device to the PCB to provide the necessary thermal, mechanical, and electrical connections between the leadframe die pad and the PCB.
OPA462 ai_powerpad_bos391.gifFigure 67. Cross Section View of a PowerPAD™ Package