SBOS940B May   2019  – December 2025 OPA818

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: VS = ±5 V
    7. 6.7 Typical Characteristics: VS = 6 V
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and ESD Protection
      2. 7.3.2 Feedback Pin
      3. 7.3.3 Decompensated Architecture With Wide Gain-Bandwidth Product
      4. 7.3.4 Low Input Capacitance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (+4/–2 V to ±6.5 V)
      2. 7.4.2 Single-Supply Operation (6 V to 13 V)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Wideband, Noninverting Operation
      2. 8.1.2 Wideband, Transimpedance Design Using the OPA818
    2. 8.2 Typical Applications
      1. 8.2.1 High-Bandwidth, 100-kΩ Gain Transimpedance Design
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Noninverting Gain of 2 V/V
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DRG|8
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

OPA818 DRG Package, 8-Pin WSON With Thermal Pad (Top View)Figure 5-1 DRG Package, 8-Pin WSON With Thermal Pad (Top View)
OPA818 DBV Package, 5-Pin SOT-23 (Top View)Figure 5-2 DBV Package, 5-Pin SOT-23 (Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
DRG
(WSON)		 DBV
(SOT-23)
FB 2 — Output Feedback resistor connection (optional)
IN– 3 4 Input Inverting input
IN+ 4 3 Input Noninverting input
NC 6 — — No connect (no internal connection to die)
OUT 7 1 Output Output of amplifier
PD 1 — Input Power down (low = enable, high = disable). Internal 1MΩ pullup allows floating this pin.
VS– 5 2 Power Negative power supply
VS+ 8 5 Power Positive power supply
Thermal pad Thermal pad — — Electrically isolated from the die substrate, but ESD diodes down-bonded to the thermal pad. Recommended connection to a heat-spreading plane, typically ground.