JAJST62 February   2024 SN74AVCH4T245-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2V ± 0.12V
    7. 5.7  Switching Characteristics, VCCA = 1.5V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA = 1.8V ± 0.15V
    9. 5.9  Switching Characteristics, VCCA = 2.5V ± 0.2V
    10. 5.10 Switching Characteristics, VCCA = 3.3V ± 0.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 7.3.4 Bus-Hold Circuitry
      5. 7.3.5 Vcc Isolation Feature
    4. 7.4 Device Functional Modes
  9.   Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1)SN74AVCH4T245-Q1UNIT
PW (TSSOP)
16 PINS
RθJAJunction-to-ambient thermal resistance(2)112.0°C/W
RθJC(top)Junction-to-case (top) thermal resistance46.8°C/W
RθJBJunction-to-board thermal resistance57.1°C/W
ψJTJunction-to-top characterization parameter5.7°C/W
ψJBJunction-to-board characterization parameter56.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.