JAJSJN1A May   2023  – September 2023 TMP4718

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 1.2-V Logic Compatible Inputs
      2. 8.3.2 Series Resistance Cancellation
      3. 8.3.3 Device Initialization, Resistor Decoding, and Default Temperature Conversion
      4. 8.3.4 Adjustable Default T_CRIT High-Temperature Limit
      5. 8.3.5 ALERT and T_CRIT Output
      6. 8.3.6 Fault Queue
      7. 8.3.7 Filtering
      8. 8.3.8 One-Shot Conversions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Interrupt and Comparator Mode
        1. 8.4.1.1 Interrupt Mode
        2. 8.4.1.2 Comparator Mode
        3. 8.4.1.3 T_CRIT Output
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 Continuous Conversion Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 I2C and SMBus Interface
      3. 8.5.3 Device Address
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Writes
        2. 8.5.4.2 Reads
      5. 8.5.5 SMBus Alert Mode
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) TMP4718 UNIT
DGK (VSSOP)
6 PINS
RθJA Junction-to-ambient thermal resistance 185.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.3 °C/W
RθJB Junction-to-board thermal resistance 107.5 °C/W
ψJT Junction-to-top characterization parameter 16.8 °C/W
ψJB Junction-to-board characterization parameter 105.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note, SPRA953.