JAJSKW6A December   2020  – October 2024 TMUXHS4412

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 High-Speed Performance Parameters
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable and Power Savings
      2. 6.3.2 Data Line Biasing
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 PCIe Lane Muxing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Pin-to-Pin Passive Versus Redriver Option
        4. 7.2.1.4 Application Curves
    3. 7.3 Systems Examples
      1. 7.3.1 PCIe Muxing for Hybrid SSD
      2. 7.3.2 DisplayPort Main Link
      3. 7.3.3 USB 4.0 / TBT 3.0 Demuxing
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Related Documentation
      1. 8.1.1 Documentation Support
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Detailed Design Procedure

The TMUXHS4412 is a high-speed passive switch device that can behave as a mux or demux. The TMUXHS4412 is a passive switch that provides no signal conditioning capability, therefore signal integrity is important. To implement PCIe lane switching topology, the designer must understand the following.

  • Determine the loss profile between circuits that are to be muxed or demuxed.
  • Provide clean impedance and electrical length matched board traces.
  • Provide a control signal for the SEL and PD pins.
  • The thermal pad must be connected to ground.
  • See the application schematics on recommended decouple capacitors from VCC pins to ground.