JAJS012J October   2004  – November 2018 TPS75003

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 Buck Converter
      2. 6.6.2 LDO Converter
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operation (Buck Controllers)
      2. 7.3.2  Enable (Buck Controllers)
      3. 7.3.3  UVLO (Buck Controllers)
      4. 7.3.4  Current Limit (Buck Controllers)
      5. 7.3.5  Short-Circuit Protection (Buck Controllers)
      6. 7.3.6  Soft-Start (Buck Controllers)
      7. 7.3.7  LDO Operation
      8. 7.3.8  Internal Current Limit (LDO)
      9. 7.3.9  Enable Pin (LDO)
      10. 7.3.10 Dropout Voltage (LDO)
      11. 7.3.11 Transient Response (LDO)
      12. 7.3.12 Thermal Protection (LDO)
      13. 7.3.13 Power Dissipation (LDO)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Input Capacitor CIN1, CIN2 Selection (Buck Controllers)
        2. 8.2.2.2  Inductor Value Selection (Buck Controllers)
        3. 8.2.2.3  External PMOS Transistor Selection (Buck Controllers)
        4. 8.2.2.4  Diode Selection (Buck Controllers)
        5. 8.2.2.5  Output Capacitor Selection (Buck Controllers)
        6. 8.2.2.6  Output Voltage Ripple Effect on VOUT (Buck Controllers)
        7. 8.2.2.7  Soft-Start Capacitor Selection (Buck Controllers)
        8. 8.2.2.8  Output Voltage Setting Selection (Buck Controllers)
        9. 8.2.2.9  Input Capacitor Selection (LDO)
        10. 8.2.2.10 Output Capacitor Selection (LDO)
        11. 8.2.2.11 Soft-Start Capacitor Selection (LDO)
        12. 8.2.2.12 Setting Output Voltage (LDO)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Considerations
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 開発サポート
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3.13 Power Dissipation (LDO)

The TPS75003 device is available in a QFN-style package with an exposed lead frame on the package underside. The exposed lead frame is the primary path for removing heat and should be soldered to a PC board that is configured to remove the amount of power dissipated by the LDO regulator, as calculated by Equation 3.

Equation 3. TPS75003 q_PD_VIN_bvs052__.gif

Power dissipation can be minimized by using the lowest possible input voltage necessary to ensure the required output voltage. The two buck converters do not contribute a significant amount of dissipated power. Using heavier copper will increase the overall effectiveness of removing heat from the device. The addition of plated through-holes to heat-dissipating layers will also improve the heatsink effectiveness.