JAJSBN7C SEPTEMBER   2011  – April  2018 TPS84210

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
      2.      効率と出力電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Package Specifications
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Switching Characteristics
    6. 6.6 Typical Characteristics (VIN = 5 V)
    7. 6.7 Typical Characteristics (VIN = 3.3 V)
  7. 7 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjusting The Output Voltage
  9. 9 Capacitor Recommendations For The TPS84210 Power Supply
    1. 9.1 Capacitor Technologies
      1. 9.1.1 Electrolytic, Polymer-Electrolytic Capacitors
      2. 9.1.2 Ceramic Capacitors
      3. 9.1.3 Tantalum, Polymer-Tantalum Capacitors
    2. 9.2 Input Capacitor
    3. 9.3 Output Capacitor
  10. 10Transient Response
  11. 11Application Schematics
  12. 12Power Good (PWRGD)
  13. 13Power-Up Characteristics
  14. 14Remote Sense
  15. 15Output On/Off Inhibit (INH)
  16. 16Slow Start (SS/TR)
  17. 17Overcurrent Protection
  18. 18Synchronization (CLK)
  19. 19Sequencing (SS/TR)
  20. 20Programmable Undervoltage Lockout (UVLO)
  21. 21Thermal Shutdown
  22. 22Layout Guidelines
  23. 23Layout Example
  24. 24EMI
  25. 25デバイスおよびドキュメントのサポート
    1. 25.1 ドキュメントの更新通知を受け取る方法
    2. 25.2 コミュニティ・リソース
    3. 25.3 商標
    4. 25.4 静電気放電に関する注意事項
    5. 25.5 Glossary
  26. 26メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3 Thermal Information

THERMAL METRIC(1) TPS84210 UNIT
RKG (QFN)
39 PINS
θJA Junction-to-ambient thermal resistance(2) 12 °C/W
ψJT Junction-to-top characterization parameter(3) 2.2 °C/W
ψJB Junction-to-board characterization parameter(4) 9.7 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.