JAJSSX2 February   2025 LMG3650R025

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Switching Parameters
      1. 7.1.1 Turn-On Times
      2. 7.1.2 Turn-Off Times
      3. 7.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 7.1.4 Zero-Voltage Detection Times (LMG3656R025 only)
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 LMG3650R025 Functional Block Diagram
      2. 8.2.2 LMG3651R025 Functional Block Diagram
      3. 8.2.3 LMG3656R025 Functional Block Diagram
      4. 8.2.4 LMG3657R025 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Drive Strength Adjustment
      2. 8.3.2 VDD Supply
      3. 8.3.3 Overcurrent and Short-Circuit Protection
      4. 8.3.4 Overtemperature Protection
      5. 8.3.5 UVLO Protection
      6. 8.3.6 Fault Reporting
      7. 8.3.7 Auxiliary LDO (LMG3651R025 Only)
      8. 8.3.8 Zero-Voltage Detection (ZVD) (LMG3656R025 Only)
      9. 8.3.9 Zero-Current Detection (ZCD) (LMG3657R025 Only)
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Slew Rate Selection
        2. 9.2.2.2 Signal Level-Shifting
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Using an Isolated Power Supply
      2. 9.3.2 Using a Bootstrap Diode
        1. 9.3.2.1 Diode Selection
        2. 9.3.2.2 Managing the Bootstrap Voltage
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

5 Pin Configuration and Functions

Figure 5-1 LMG3650R025, TOLL Package (Top View)
Figure 5-3 LMG3656R025, TOLL Package (Top View)
Figure 5-2 LMG3651R025, TOLL Package (Top View)
Figure 5-4 LMG3657R025, TOLL Package (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME LMG3650R025 LMG3651R025 LMG3656R025 LMG3657R025
SRC 1 - 4 1 - 4 1 - 4 1 - 4 P GaN FET source.
FLT/RDRV 5 5 5 5 O, I Fault monitoring and drive strength selection pin. Connect a resistor from this pin to GND to set the turn-on drive strength. Connect a resistor in series with capacitor from this pin to GND to set the turn-off drive strength. Slew rates are set one time at the time of power up, then the pin is used for fault monitoring.
VDD 6 6 6 6 P Device input supply
GND 7 — — — G Signal ground. Internally connected to SRC, and THERMAL PAD.
LDO5V — 7 — — P 5V LDO output for external digital isolator.
ZVD — — 7 — O Push-pull digital output that provides zero-voltage detection signal to indicate if device achieves zero-voltage switching in current switching cycle.
ZCD — — — 7 O Push-pull digital output that sets ZCD pin high when the drain-to-source current is negative and transitions to low upon detecting the zero-crossing point.
IN 8 8 8 8 I CMOS compatible non inverting input used to turn the FET on and off
DRN 9 9 9 9 P GaN FET drain
THERMAL PAD — — — — — Thermal pad.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.