JAJSSX2 February   2025 LMG3650R025

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. Parameter Measurement Information
    1. 7.1 Switching Parameters
      1. 7.1.1 Turn-On Times
      2. 7.1.2 Turn-Off Times
      3. 7.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 7.1.4 Zero-Voltage Detection Times (LMG3656R025 only)
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 LMG3650R025 Functional Block Diagram
      2. 8.2.2 LMG3651R025 Functional Block Diagram
      3. 8.2.3 LMG3656R025 Functional Block Diagram
      4. 8.2.4 LMG3657R025 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Drive Strength Adjustment
      2. 8.3.2 VDD Supply
      3. 8.3.3 Overcurrent and Short-Circuit Protection
      4. 8.3.4 Overtemperature Protection
      5. 8.3.5 UVLO Protection
      6. 8.3.6 Fault Reporting
      7. 8.3.7 Auxiliary LDO (LMG3651R025 Only)
      8. 8.3.8 Zero-Voltage Detection (ZVD) (LMG3656R025 Only)
      9. 8.3.9 Zero-Current Detection (ZCD) (LMG3657R025 Only)
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Slew Rate Selection
        2. 9.2.2.2 Signal Level-Shifting
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Using an Isolated Power Supply
      2. 9.3.2 Using a Bootstrap Diode
        1. 9.3.2.1 Diode Selection
        2. 9.3.2.2 Managing the Bootstrap Voltage
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Switching Parameters

Figure 7-1 shows the circuit used to measure most switching parameters. The top device in this circuit is used to re-circulate the inductor current and functions in third-quadrant mode only. The bottom device is the active device that turns on to increase the inductor current to the desired test current. The bottom device is then turned off and on to create switching waveforms at a specific inductor current. Both the drain current (at the source) and the drain-source voltage is measured. Figure 7-2 shows the specific timing measurement. TI recommends to use the half-bridge as a double pulse tester. Excessive third-quadrant operation can overheat the top device.

LMG3650R025 LMG3651R025 LMG3656R025 LMG3657R025 Circuit Used to Determine Switching Parameters Figure 7-1 Circuit Used to Determine Switching Parameters
LMG3650R025 LMG3651R025 LMG3656R025 LMG3657R025 Measurement to Determine Propagation Delays and Slew
                    Rates Figure 7-2 Measurement to Determine Propagation Delays and Slew Rates