JAJSSX2 February   2025 LMG3650R025

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Switching Parameters
      1. 7.1.1 Turn-On Times
      2. 7.1.2 Turn-Off Times
      3. 7.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 7.1.4 Zero-Voltage Detection Times (LMG3656R025 only)
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 LMG3650R025 Functional Block Diagram
      2. 8.2.2 LMG3651R025 Functional Block Diagram
      3. 8.2.3 LMG3656R025 Functional Block Diagram
      4. 8.2.4 LMG3657R025 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Drive Strength Adjustment
      2. 8.3.2 VDD Supply
      3. 8.3.3 Overcurrent and Short-Circuit Protection
      4. 8.3.4 Overtemperature Protection
      5. 8.3.5 UVLO Protection
      6. 8.3.6 Fault Reporting
      7. 8.3.7 Auxiliary LDO (LMG3651R025 Only)
      8. 8.3.8 Zero-Voltage Detection (ZVD) (LMG3656R025 Only)
      9. 8.3.9 Zero-Current Detection (ZCD) (LMG3657R025 Only)
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Slew Rate Selection
        2. 9.2.2.2 Signal Level-Shifting
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Using an Isolated Power Supply
      2. 9.3.2 Using a Bootstrap Diode
        1. 9.3.2.1 Diode Selection
        2. 9.3.2.2 Managing the Bootstrap Voltage
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

9.4.1 Layout Guidelines

The layout of the LMG365xR025 is critical to its performance and functionality. Because the half-bridge configuration is typically used with these GaN devices, layout recommendations are considered with this configuration. A four-layer or higher layer count board is required to reduce the parasitic inductances of the layout to achieve suitable performance. Critical layout guidelines are summarized below, and more details are further elaborated in the following sections.

LMG3650R025 LMG3651R025 LMG3656R025 LMG3657R025 LMG3650R025 Typical Schematic With Layout Considerations Figure 9-9 LMG3650R025 Typical Schematic With Layout Considerations
LMG3650R025 LMG3651R025 LMG3656R025 LMG3657R025 LMG3651R025 Typical Schematic With Layout Considerations Figure 9-10 LMG3651R025 Typical Schematic With Layout Considerations
LMG3650R025 LMG3651R025 LMG3656R025 LMG3657R025 LMG3656R025 or LMG3657R025 Typical Schematic With Layout Considerations Figure 9-11 LMG3656R025 or LMG3657R025 Typical Schematic With Layout Considerations