JAJSVB9B September   2024  – February 2025 ISO6163

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5V Supply (±10%)
    10. 5.10 Supply Current Characteristics—5V Supply (±10%)
    11. 5.11 Electrical Characteristics—3.3V Supply (±10%)
    12. 5.12 Supply Current Characteristics—3.3V Supply (±10%)
    13. 5.13 Electrical Characteristics—2.5V Supply (Minimum)
    14. 5.14 Supply Current Characteristics—2.5V Supply  (Minimum)
    15. 5.15 Switching Characteristics—5V Supply (±10%)
    16. 5.16 Switching Characteristics—3.3V Supply (±10%)
    17. 5.17 Switching Characteristics—2.5V Supply (Minimum)
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
      1. 5.19.1 Typical Characteristics: Supply Current ACTIVE state
      2. 5.19.2 Typical Characteristics: High-Speed Channels (ACTIVE state)
      3. 5.19.3 Typical Characteristics: Supply Current STANDBY State
      4. 5.19.4 Typical Characteristics: Low-Speed Control Channels (ACTIVE and STANDBY States)
      5. 5.19.5 Typical Characteristics: Undervoltage Threshold
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Functional Block Diagram
      2. 7.1.2 Feature Description
    2. 7.2 High-Speed Data Channels: A, B, E and F
    3. 7.3 Low-Speed Control Channels With Automatic Enable: C and D
      1. 7.3.1 Low-Speed Control Channels: Timing and Level Details for Automatic Enable
      2. 7.3.2 Low-Speed Control Channels: Considerations if Used for Data
      3. 7.3.3 Low-Speed Control Channels: Considerations During Power Up and Device Reset Events
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

9.4 Trademarks

テキサス・インスツルメンツ E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.