SLAU278AH May   2009  – March 2021

 

  1. 1Read This First
    1. 1.1 How to Use This Manual
    2. 1.1 Information About Cautions and Warnings
    3. 1.1 Related Documentation From Texas Instruments
    4. 1.1 If You Need Assistance
    5. 1.1 Trademarks
  2. 1Get Started Now!
    1. 1.1  Kit Contents, MSP-TS430xx
    2. 1.2  Kit Contents, MSP-FET430xx
    3. 1.3  Kit Contents, MSP-FET
    4. 1.4  Kit Contents, MSP-FET430UIF
    5. 1.5  Kit Contents, MSP-FET430PIF
    6. 1.6  Kit Contents, eZ430-F2013
    7. 1.7  Kit Contents, eZ430-T2012
    8. 1.8  Kit Contents, eZ430-RF2500
    9. 1.9  Kit Contents, eZ430-RF2500T
    10. 1.10 Kit Contents, eZ430-RF2500-SEH
    11. 1.11 Kit Contents, eZ430-Chronos-xxx
    12. 1.12 Kit Contents, FET430F6137RF900
    13. 1.13 Kit Contents, EM430Fx1x7RF900
    14. 1.14 Hardware Installation, MSP-FET and MSP-FET430UIF
    15. 1.15 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900
    16. 1.16 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529
    17. 1.17 Important MSP430 Documents on the Web
  3. 2Design Considerations for In-Circuit Programming
    1. 2.1 Signal Connections for In-System Programming and Debugging
    2. 2.2 External Power
    3. 2.3 Bootloader (BSL)
      1.      A Frequently Asked Questions and Known Issues
        1.       A.1 Hardware FAQs
        2.       A.2 Known Issues
          1.        MSP-FET430UIF
          2.        MSP-FET430PIF
            1.         B Hardware
              1.          B.1 MSP-TS430D8
              2.          B.2 MSP-TS430PW14
              3.          B.3 MSP-TS430L092
              4.          B.4 MSP-TS430L092 Active Cable
              5.          B.5 MSP-TS430PW20
              6.          B.6 MSP-TS430RHL20
              7.          B.7 MSP-TS430PW24
              8.          B.8 MSP-TS430RGE24A
              9.          B.9 MSP-TS430DW28
              10.          B.10 MSP-TS430PW28
              11.          B.11 MSP-TS430PW28A
              12.          B.12 MSP-TS430RHB32A
              13.          B.13 MSP-TS430DA38
              14.          B.14 MSP-TS430QFN23x0
              15.          B.15 MSP-TS430RSB40
              16.          B.16 MSP-TS430RHA40A
              17.          B.17 MSP-TS430DL48
              18.          B.18 MSP-TS430PT48
              19.          B.19 MSP-TS430PT48A
              20.          B.20 MSP-TS430RGZ48B
              21.          B.21 MSP-TS430RGZ48C
              22.          B.22 MSP-TS430PM64
              23.          B.23 MSP-TS430PM64A
              24.          B.24 MSP-TS430PM64D
              25.          B.25 MSP-TS430PM64F
              26.          B.26 MSP-TS430RGC64B
              27.          B.27 MSP-TS430RGC64C
              28.          B.28 MSP-TS430RGC64USB
              29.          B.29 MSP-TS430PN80
              30.          B.30 MSP-TS430PN80A
              31.          B.31 MSP-TS430PN80B
              32.          B.32 MSP-TS430PN80C
              33.          B.33 MSP-TS430PN80USB
              34.          B.34 MSP-TS430PZ100
              35.          B.35 MSP-TS430PZ100A
              36.          B.36 MSP-TS430PZ100B
              37.          B.37 MSP-TS430PZ100C
              38.          B.38 MSP-TS430PZ100D
              39.          B.39 MSP-TS430PZ100E
              40.          B.40 MSP-TS430PZ5x100
              41.          B.41 MSP-TS430PZ100USB
              42.          B.42 MSP-TS430PZ100AUSB
              43.          B.43 MSP-TS430PEU128
              44.          B.44 EM430F5137RF900
              45.          B.45 EM430F6137RF900
              46.          B.46 EM430F6147RF900
                1.           C Hardware Installation Guide
                  1.            D Revision History

B.27 MSP-TS430RGC64C

The MSP-TS430RGC64C target board has been designed with the option to operate with the target device DVIO input voltage supplied via header J6 (see Figure 5-54). This development platform does not supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device operation. For correct JTAG connection, programming, and debug operation, it is important to follow this procedure:

  1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to 0 V.
  2. Enable the 1.8-V external DVIO power supply.
  3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-FET430UIF JTAG debugger interface).
  4. Connect the MSP-FET430UIF JTAG connector to the target board.
  5. Start the debug session using IAR or CCS IDE.

For more information on debugging the MSP430F522x and MSP430F525x, see the device-specific data sheets (MSP430F522x and MSP430F525x) and Designing with MSP430F522x and MSP430F521x Devices.

For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain, short JP4 with the jumper.

GUID-0B9BF660-466B-4E3D-8056-F16C8F353CA6-low.gifFigure 4-54 MSP-TS430RGC64C Target Socket Module, Schematic
GUID-CB8FB421-ADDE-4DDB-AEF1-36B626BDE690-low.gifFigure 4-55 MSP-TS430RGC64C Target Socket Module, PCB
Note:

For bootloader use, the BSL connector and only one of the resistors R11 or R12 must be populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is supplied externally, R12 (0 Ω) must be assembled, and R11 must be removed.

Table 4-28 MSP-TS430RGC64C Bill of Materials
ItemQtyReferenceValueDescriptionCommentSupplier No.
10C1, C212pFCAP, SMD, Ceramic, 0805DNP C1 C2
20C3, C4CAP, SMD, Ceramic, 0805DNP C3 C4
43C5, C7, C1010uFCAP, SMD, Ceramic, 0805
55C8 C6 C13-15100nFCAP, SMD, Ceramic, 0805Digi-Key: 311-1245-2-ND
55C82.2nFCAP, SMD, Ceramic, 0805
61C9470nFCAP, SMD, Ceramic, 0805Digi-Key: 478-1403-2-ND
71C164.7uFCAP, SMD, Ceramic, 0805
81D1Green LEDLED, SMD, 0805
94J1-J416-pin headerPin header 1x16: Grid: 100mil (2.54 mm)DNP: headers and receptacles enclosed with kit. Keep vias free of solder.
: Header
: Receptacle		SAM1029-16-ND SAM1213-16-ND
102J5, J63-pin header, male, THPin header 1x3: Grid: 100mil (2.54 mm)SAM1035-03-ND
11JP5, JP6, JP7, JP8, JP9, JP103-pin header, male, THPinheader 1x3: Grid: 100mil (2.54 mm)place jumpers on pins 2-3SAM1035-03-ND
12JP33-pin header, male, THPin header 1x3: Grid: 100mil (2.54 mm)place jumper on pins 1-2SAM1035-03-ND
13JP1, JP2, JP42-pin header, male, THPin header 1x2; Grid: 100mil (2.54 mm)place jumper on headerSAM1035-02-ND
1410JumperPlace on: JP1, JP2, JP3, JP4, JP5, JP6, JP7, JP8, JP9, JP1015-38-1024-ND
151JTAG2x7Pin,WanneHeader, THD, Male 2x7 Pin, Wanne, 100mil spacingHRP14H-ND
160BOOTST2x5Pin,WanneHeader, THD, Male 2x5 Pin, Wanne, 100mil spacingDNP
171Q126MHz/ASX53CRYSTAL, SMD, 5x3MM, 26MHzOnly Kit.
180Q226MHz/ASX53CRYSTAL, SMD, 5x3MM, 26MHz300-8219-1-ND
191D3LL103ADIODE, SMD, SOD123, SchottkyBuerklin: 24S3406
202R3, R7330 Ohm, SMD0805541-330ATR-ND
211R547k Ohm, SMD0805RES, SMD, 0805, 1/8W, x%541-47000ATR-ND
22R1, R2, R4, R6, R8, R9, R10, R11, R120 Ohm, SMD0805RES, SMD, 0805, 1/8W, x%DNP: R6, R8, R9, R10, R11,R12541-000ATR-ND
231U1Socket: QFN11T064-006-N-HSPManuf.: Yamaichi
242MSP430MSP430F5229IRGCRIC, MCU, SMD, 9.15x9.15mm Thermal Pad with Socket
254Rubber stand offRubber stand offapply to corners at bottom sideBuerklin: 20H1724
261PCB84 x 76 mm84 x 76 mm