SLVUDH6 September   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Replace U1: Solder reflow
    3. 1.3 Replace R1:
    4. 1.4 Kit Contents
    5. 1.5 Specification
    6. 1.6 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Power Requirements
    3. 2.3 Recommended Test Equipment
    4. 2.4 Setup
    5. 2.5 External Connections for Easy Evaluation
    6. 2.6 Test Points
    7. 2.7 Oscilloscope Probes: Probing the EVM
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 PCB Layout Guidelines
    4. 3.4 PCB Layout Example
    5. 3.5 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

2 Hardware

UCC35341-Q1, UCC34141EVM-116
WARNING:
  • Caution Hot Surface. Contact may cause burns. U1 package surface can reach temperatures of 45°C above ambient. Do not touch!
  • If you are not trained in proper safety, handling and testing power electronics, please do not test this EVM