SLVUDH6 September   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Replace U1: Solder reflow
    3. 1.3 Replace R1:
    4. 1.4 Kit Contents
    5. 1.5 Specification
    6. 1.6 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Power Requirements
    3. 2.3 Recommended Test Equipment
    4. 2.4 Setup
    5. 2.5 External Connections for Easy Evaluation
    6. 2.6 Test Points
    7. 2.7 Oscilloscope Probes: Probing the EVM
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 PCB Layout Guidelines
    4. 3.4 PCB Layout Example
    5. 3.5 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

2.7 Oscilloscope Probes: Probing the EVM

Using TP9-11 oscilloscope probe PCB test points: The UCC35341-Q1 is a high frequency DC-DC module that requires careful measurement for accurately capturing transient events and measuring high frequency, AC ripple voltage. Remove the "witch hat" probe tip cover and ground lead from the scope probe. If scope probe ground springs are not available, wrap a piece of 22 AWG bare wire around the scope probe ground ring or use a fitted ground spring and insert the probe tip and ground into the EVM as shown in Figure 2-2.

UCC35341-Q1, UCC34141EVM-116 PCB Scope Probe Test Points Figure 2-2 PCB Scope Probe Test Points

The EVM output nomenclature (VDD, VEE, COM) corresponds to what is commonly used when referring to isolated gate driver ICs. As shown in Figure 3-1, TP4 (COM) is the midpoint reference intended to connect to the COM pin of the isolated gate driver IC. When the UCC35341-Q1 is used to bias a gate driver IC, VDD (VDD-COM) and VEE (VEE-COM) are referred to with respect to COM.