SNVU891
February 2025
1
Description
Get Started
Features
Applications
6
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specifications
1.3.1
Application Circuit Diagrams
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Line and Load Regulation, Efficiency
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Load Transient Response
3.1.2.2
Start-Up and Shutdown With VIN
3.1.2.3
Start-Up and Shutdown With ENABLE ON and OFF
3.1.2.4
Switching Operation
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.2.1
Component Drawings
4.2.2
Layout Guidelines
4.3
Bill of Materials
5
Additional Information
5.1
Trademarks
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.2
Documentation Support
6.2.1
Related Documentation
6.2.1.1
Low-EMI Design Resources
6.2.1.2
PCB Layout Resources
6.2.1.3
Thermal Design Resources
6.2.1.3
Thermal Design Resources
White paper:
Texas Instruments,
Improving Thermal Performance in High Ambient Temperature Environments With Thermally Enhanced Packaging
Applications notes:
Texas Instruments,
Thermal Design by Insight, Not Hindsight
Texas Instruments,
A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
PowerPAD™ Made Easy
Texas Instruments,
Using New Thermal Metrics