SWRS223D February   2020  – February 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Signal Descriptions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Power-On Hours (POH)
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Power Supply Specifications
    6. 7.6 Power Consumption Summary
    7. 7.7 RF Specification
    8. 7.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 7.9 Timing and Switching Characteristics
      1. 7.9.1 Power Supply Sequencing and Reset Timing
      2. 7.9.2 Synchronized Frame Triggering
      3. 7.9.3 Input Clocks and Oscillators
        1. 7.9.3.1 Clock Specifications
      4. 7.9.4 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.9.4.1 Peripheral Description
          1. 7.9.4.1.1 SPI Timing Conditions
          2. 7.9.4.1.2 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          3. 7.9.4.1.3 SPI Peripheral Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        2. 7.9.4.2 Typical Interface Protocol Diagram (Peripheral Mode)
      5. 7.9.5 Inter-Integrated Circuit Interface (I2C)
        1. 7.9.5.1 I2C Timing Requirements
      6. 7.9.6 LVDS Interface Configuration
        1. 7.9.6.1 LVDS Interface Timings
      7. 7.9.7 General-Purpose Input/Output
        1. 7.9.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.9.8 Camera Serial Interface (CSI)
        1. 7.9.8.1 CSI Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Host Interface
    4. 8.4 Other Subsystems
      1. 8.4.1 ADC Data Format Over CSI2 Interface
      2. 8.4.2 ADC Channels (Service) for User Application
        1. 8.4.2.1 GPADC Parameters
  10. 9 Monitoring and Diagnostic Mechanisms
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short-, Medium-, and Long-Range Radar
    3. 10.3 Imaging Radar using Cascade Configuration
    4. 10.4 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Export Control Notice
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

3 Description

The AWR2243 device is an integrated single-chip FMCW transceiver capable of operation in the 76GHz to 81GHz band. The device enables unprecedented levels of integration in an extremely small form factor. AWR2243 is designed for low power, self-monitored, ultra-accurate radar systems in the automotive space.

The AWR2243 device is a self-contained FMCW transceiver single-chip device that simplifies the implementation of Automotive Radar sensors in the band of 76GHz to 81GHz. The device is built on TI’s low-power 45nm RFCMOS process, which enables a monolithic implementation of a 3TX, 4RX system with built-in PLL and ADC converters. Simple programming model changes can enable a wide variety of sensor implementation (Short, Mid, Long) with the possibility of dynamic reconfiguration for implementing a multimode sensor. Additionally, the device is provided as a complete platform device including reference hardware design, software drivers, sample configurations, API guide, and user documentation.

Device Information
PART NUMBER(1)PACKAGEBODY SIZE
AWR2243ABGABLQ1 (Tray)ABL (FCBGA, 161)10.4mm × 10.4mm
AWR2243ABGABLRQ1 (Reel)ABL (FCBGA, 161)10.4mm × 10.4mm
(1) For more information, see Section 13, Mechanical Packaging and Orderable Information.