DLPA052A November   2014  – August 2025 DLP9000 , DLP9000X , DLP9500 , DLPC900 , DLPC910

 

  1.   1
  2.   System Design Considerations Using TI DLP Technology down to 400 nm
  3.   Trademarks
  4. 1Introduction
  5. 2Thermal Considerations
  6. 3Duty Cycle Considerations
  7. 4Coherency Considerations
  8. 5Optical Considerations
  9. 6High De-magnification System Considerations
    1. 6.1 Incoherent Sources (Lamps and LEDs)
    2. 6.2 Coherent Sources (Lasers)
  10. 7Summary
  11. 8References
  12. 9Revision History

Thermal Considerations

Although Type A DMD devices are capable of operating at shorter wavelengths, these devices are not completely impervious to the effects. DMD array temperature becomes an important factor when operating in the deep blue portion of the spectrum down to 400nm.

Keeping DMD array temperatures below 30° C with 20° to 25° C is preferred which can be accomplished with passive or even active cooling such as a thermo electric cooler [TEC]. For Type A DMDs, care needs to be taken to avoid introducing temperature gradients greater than 10° C between any two points on the package or between any point on the package and the DMD array.

Maintaining the temperature and thermal gradient within the specifications defined in the data sheet promotes best performance of the DMD when used with higher energy photons.

TI has an excellent application note Digital Micromirror Device Thermal Considerations Including Pulsed Optical Sources, application note that covers in great detail general thermal considerations for DMDs.