SBOS124C January   2000  – January 2026 XTR115 , XTR116

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reverse-Voltage Protection
      2. 7.3.2 Overvoltage Surge Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Transistor
      2. 8.1.2 Minimum Scale Current
      3. 8.1.3 Offsetting the Input
      4. 8.1.4 Maximum Output Current
      5. 8.1.5 Radio Frequency Interference
      6. 8.1.6 Circuit Stability
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

12 Revision History

Changes from Revision B (March 2022) to Revision C (January 2026)

  • Updated numbering format throughout the documentGo
  • Added standard package information and moved the comparison table to Device Comparison sectionGo
  • Added description of device flow information in Specifications Go
  • Added all chip site origin (CSO) to typical test conditions in Electrical Characteristics Go
  • Added additional fabrication process specification for Bias Current and Bias Current vs Temperature in Electrical Characteristics tableGo
  • Added additional fabrication process specification for Slew Rate in Electrical Characteristics tableGo
  • Added additional fabrication process specification for VREF Voltage Accuracy and Voltage Accuracy vs Load in Electrical Characteristics tableGo
  • Added additional fabrication process specification for VREG Voltage Accuracy in Electrical Characteristics tableGo
  • Added additional fabrication process specification for VREG Voltage Accuracy vs Power Supply in Electrical Characteristics tableGo
  • Added additional fabrication process specification for Quiescent Current in Electrical Characteristics tableGo
  • Added all chip site origin (CSO) to typical test conditions in Typical Characteristics Go
  • Updated Quiescent Current vs Temperature, Reference Voltage vs Temperature, Overscale Current vs Temperature, and VREG Voltage vs VREG Current to align with absolute maximum temperature rating in Typical Characteristics Go
  • Added additional fabrication process curve for Quiescent Current vs Temperature in Typical Characteristics sectionGo
  • Added Device Functional Modes sectionGo
  • Added Power Supply Recommendations and Layout sectionGo
  • Added part number fabrication process information table in Device Support Go

Changes from Revision A (November 2003) to Revision B (March 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Pin Functions, ESD Ratings, Thermal Information, Recommended Operating Conditions, and Electrical Characteristics tables, and Detailed Description, Overview, Functional Block Diagram, Feature Description, Application and Implementation, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added Pin Functions tableGo
  • Changed "Operating temperature" absolute minimum from "–55℃" to "–40℃" and moved temperature specifications to Absolute Maximum Ratings tableGo
  • Changed "Span error" specification test condition from "IIN = 250 µA to 25 mA", to "IOUT = 250 µA to 25 mA", in Electrical Characteristics Go
  • Changed VREF "Voltage accuracy vs load" typical specification from ±100 ppm/mA to ±200 ppm/mA in Electrical Characteristics Go
  • Changed Basic Circuit Connections application diagramGo
  • Changed External Transistor applications information section to incorporate additional guidance regarding transistor power dissipation and thermal concernsGo
  • Added Circuit Stability application information sectionGo